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Advanced Electronics Packaging Digest

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SAIC Acquires Information Security Corp., Expands Zero-Trust and Encryption Capabilities

10/05/2026 | SAIC
Science Applications International Corp., a leading mission integrator supporting defense, space, intelligence, and civilian agencies, announced it has completed the acquisition of Information Security Corporation (ISC).

Qnity Showcases Materials Innovations Powering the Next Leap in Electronics at TPCA Show 2026

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Infineon, Eaton Advance SiC Solid-State Transformers for 800 VDC AI Data Centers

09/29/2026 | Infineon
Infineon Technologies AG will deliver silicon carbide (SiC) power devices to Eaton, an intelligent power management company, for use in its medium-voltage solid-state transformer (MVSST) 2.0 platform designed for deployment across APAC.

Koh Young Turns Measurement-based Inspection Data into Manufacturing Intelligence at SMTA International 2026

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Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will showcase its latest inspection and process optimization technologies at SMTA International 2026 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

Cetec ERP, Boardera Announce Integration Partnership for Faster PCB Assembly Quoting

09/28/2026 | Cetec ERP
Cetec ERP and Boardera Software Inc. have announced an integration partnership designed to help electronics manufacturing services (EMS) and contract manufacturing companies move more efficiently from incoming RFQ to production-ready quote.
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