Insulectro Leverages One Source Distribution for Printed Electronic Materials at IDTechEx Show
November 13, 2017 | InsulectroEstimated reading time: 3 minutes
Insulectro will exhibit in booth L13 at IDTechEx’s Printed Electronics World 2017 conference held this week, November 15-16, in Santa Clara, California at the Convention Center.
Insulectro Printed Electronics offers advanced materials from such leading suppliers such as DuPont, Chromaline, Coveme, and Kodak to sell conductive inks, substrates, and consumables.
Insulectro distributes key DuPont polymer thick film paste products to U.S. customers in the thin film photovoltaic, wearables, in-mold, capacitive switch, touch screen, RFID smart card, heating and membrane touch switch markets. In addition, Insulectro Printed Electronics distributes carbon conductors and UV dielectrics on behalf of DuPont.
Kevin Miller, vice president of Sales for Insulectro Printed Electronics, commented, “We are excited to showcase our products at Printed Electronics World. We are a one-source supplier for PE manufacturers with our complete offerings of essential and cutting edge materials. With 10 stocking locations throughout North America, we are where our customers are.
“We developed a strong sales and service model on Insulectro’s PCB-side of our business over a long period of years. That wealth of knowledge transfers readily to printed electronics. Now, Insulectro’s Printed Electronics Division is making a difference in that industry.”
Recently, Insulectro was named distributor for DuPont’s innovative In-Mold electronic inks.
“In-Mold conductive inks are a perfect union of form and function. The technology combines an innovative, more stretchable material with dramatic advancements in electronic ink to give interface designers new creative freedom, without any compromise in meeting functional switching needs,” Miller continued.
“And because these new electronic inks work with existing in-mold decorative processes, there’s no need for costly re-tooling. Fabricators can create products with greater eye appeal, simplicity, and performance—all at the same time.
“In addition to the inks, Insulectro will be premiering some exceptional substrates from Italian manufacturer Coveme. Coveme’s coating technology introduces in the market a new solution based on a deep thermoforming bi-oriented polyester film with special coating on both sides that enhances printability, hardness and scratch resistance.
“Plus, Coveme’s Kemafoil KTF HC and HCH is clear Bi-oriented thermoformable polyester film, treated one or two sides specially developed for Film Insert Moulding (FIM) application. KTF HC is treated outside with a thermoformable dual cure coating with abrasion and scratch resistance (after UV curing). Drop by our booth to learn more,” Miller stated.
Insulectro Printed Electronics’ Product Specialist Jeff Parker is excited about the array of conductive inks offered, “DuPont is the predominant manufacturer of silver, copper, carbon, and dielectric inks. Insulectro’s got them all. Whether your application is membrane touch switches or printable heaters, there is an advanced material for your needs. And, in the wearables market, stretchable inks are rewriting the electronics gamebook. In our booth, you’ll see real examples of cutting edge technologies just about to hit the commercial market.
“Also this year, we will be demonstrating SPF Inc.’s Metallograph continuous dry metal printing technology in our booth. The demonstration will use an off-the-shelf Zebra label printer, polyester films from Insulectro and Metallograph® ribbons from IIMAK, polyester films from Insulectro and papers from UPM Raflatac to print antennas and circuits. Come by and see how a simple printer can created a RAIN (passive UHF) RFID antenna,” Parker enthused.
Miller added, “There’s lots of excitement this year for Insulectro Printed Electronics. Stop by our booth, L13, at IDTechEx’s Printed Electronics World 2017 and let’s get acquainted. Wherever you are manufacturing printed electronics – Minneapolis, Chicago, Dallas, Silicon Valley, Southern California, Denver, Phoenix, Salt Lake City, Northwest, Northeast or Mid-Atlantic – we are there to service you.”
About Insulectro
Insulectro is the largest supplier of PCB and PE materials. Insulectro combines its premier product offering with local inventory in strategic stocking locations across the country, fabrication capabilities and backed up by expert customer and technical support services.
Insulectro supplies advanced engineered materials manufactured by DuPont Advanced Materials, Kodak, Chromaline, 3M, Coveme, DuPont Circuit & Packaging Materials, Isola, LCOA, CAC, Inc., Integral Technology, Pacothane, Oak Mitsui, Shikoku, Saint Gobain, and Focus Tech Chemicals.
For more information, click here.
Suggested Items
sureCore Now Licensing its CryoMem Range of IP for Quantum Computing
11/26/2024 | sureCoresureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from $3.9 billion in 2024 to $9.2 billion by 2031.