Researchers Discover Big Cryptographic Potential in Nanomaterial
November 29, 2017 | New York University Tandon School of EngineeringEstimated reading time: 1 minute

The next generation of electronic hardware security may be at hand as researchers at New York University Tandon School of Engineering introduce a new class of unclonable cybersecurity security primitives made of a low-cost nanomaterial with the highest possible level of structural randomness. Randomness is highly desirable for constructing the security primitives that encrypt and thereby secure computer hardware and data physically, rather than by programming.
In a paper published in the journal ACS Nano, Assistant Professor of Electrical and Computer Engineering Davood Shahrjerdi and his NYU Tandon team offer the first proof of complete spatial randomness in atomically thin molybdenum disulfide (MoS2). The researchers grew the nanomaterial in layers, each roughly one million times thinner than a human hair. By varying the thickness of each layer, Shahrjerdi explained, they tuned the size and type of energy band structure, which in turn affects the properties of the material.
"At monolayer thickness, this material has the optical properties of a semiconductor that emits light, but at multilayer, the properties change, and the material no longer emits light. This property is unique to this material," he said. By tuning the material growth process, the resulting thin film is speckled with randomly occurring regions that alternately emit or do not emit light. When exposed to light, this pattern translates into a one-of-a-kind authentication key that could secure hardware components at minimal cost.
Shahrjerdi said his team was pondering potential applications for what he described as the beautiful random light patterns of MoS2 when he realized it would be highly valuable as a cryptographic primitive.
This represents the first physically unclonable security primitive created using this nanomaterial. Typically embedded in integrated circuits, physically unclonable security primitives protect or authenticate hardware or digital information. They interact with a stimulus -- in this case, light -- to produce a unique response that can serve as a cryptographic key or means of authentication.
The research team envisions a future in which similar nanomaterial-based security primitives can be inexpensively produced at scale and applied to a chip or other hardware component, much like a postage stamp to a letter. "No metal contacts are required, and production could take place independently of the chip fabrication process," Shahrjerdi said. "It's maximum security with minimal investment."
Suggested Items
Ventec Strengthens Commitment to Halogen-Free PCB Manufacturing in Europe
06/11/2025 | Ventec International GroupVentec International Group, the PCB materials innovator, manufacturer, supplier and one-stop shop for copper clad laminates, prepregs, as well as process consumables and PCB manufacturing equipment has established volume inventory of halogen-free FR4.1 and FR15.1 PCB materials at its European hub in Germany.
ACCM Joins Polar’s Speedstack Material Partner Program
06/10/2025 | Polar InstrumentsAdvance Chip & Circuit Materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain.
DuPont/Qnity Innovators in Semiconductor Materials Named 2025 Heroes of Chemistry
06/10/2025 | DuPontDuPont today announced that 13 of its current and former scientists and engineers have been named 2025 Heroes of Chemistry by the American Chemical Society (ACS) for an innovative program that progressed semiconductor lithography.
Ventec International Group Enters into a Fulfillment and Supply Agreement with Matrix and Launches Ventec Americas
06/09/2025 | Ventec International GroupVentec is excited to announce a new partnership with Matrix aimed at enhancing the fulfillment, value-added conversion, and distribution of PCB base materials across the North American market. This collaboration is set to significantly improve supply chain efficiency, and delivery performance for the company's North American customers.
Technica Expands into Emerging Printed Electronics and Advanced Coatings Markets
06/04/2025 | Technica USATechnica is expanding its product portfolio with Agfa’s advanced line of Orgacon conductive coatings. The Orgacon products are a natural complement to Technica’s existing solutions and will allow the company to deliver greater value to customers in these markets.