The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
American Made Advocacy: Reshoring—About Trust, Not Just Geography
AIM to Host SMT High-Reliability Technology Seminar in China
December 4, 2017 | AIM SolderEstimated reading time: 2 minutes
AIM Solder will co-host the SMT Electronics Assembly High-Reliability Technology Seminar in Shenzhen, China on December 8, 2017. AIM will present two of its most recent papers at the seminar.
Derek Wang, Technical Support Manager, will present the white paper titled “An In-Depth Look at a New Low Cost and High-Reliability Alloy Alternative to SAC305 and Low-/No-Silver Alloys.” His presentation will cover the evolution of lead-free soldering and the limitations of SAC305, the current standard for lead-free electronics soldering. It will explore the effects of nickel, bismuth and other micro-alloy dopants on mechanical and soldering performance.
Flopy Feng, Technical Support Engineer, will present AIM’s paper “The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance,” which highlights the benefits and implications of finer mesh solder powder on critical aspects of solder paste performance. In this study, the key input variables included powder size, effect of room temperature storage, pause time and PCB feature types. Output included print transfer efficiency, volume repeatability and performance stability over time.
This free seminar, hosted by AIM, Axxon, Mycronic, and Zestron, will be held at the Silicon Valley Power Vehicle Electronic Business Park in Shenzhen, China. For more information, please contact Michelle Peng via email at mpeng@aimsolder.com or by phone at 130-6694-5432.
About the Presenters
Derek Wang is a Technical Support Manager for AIM Solder. He is a SMTA Certified Engineer and also serves as a SMT Processes Trainer. With over thirteen years’ experience in the SMT industry, Derek supports AIM customers in Eastern China.
Flopy Feng is a Technical Support Engineer for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over fourteen years’ experience in the SMT industry, Flopy supports AIM customers in south China.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.