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Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing

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I attended INEMI’s June 12 online seminar, “Sustainable Electronics Tech Topic Series: PCBs and Sustainability.” Dr. Maarten Cauwe of imec spoke on “Life Cycle Inventory (LCI) Models for Assessing and Improving the Environmental Impact of PCB Assemblies,” and Jack Herring of Jiva Materials Ltd. spoke on “Transforming Electronics with Recyclable PCB Technology.” This column will review information and provide analysis from both presentations.

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EMC Taiwan Receives IPC-4101 Qualified Products Listing Certification

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Materials and Manufacturing for the AI Era: The Next PCB Frontier

08/08/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial Team
AI is pushing hardware to its limits, and the bottleneck isn’t design anymore—it’s materials. Next-generation AI servers aren’t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T Ethernet systems. Many server motherboards are already 32–36 layers. For the next wave of 1.6T-capable boards,  expect 40–50 layers, which must maintain high-frequency performance without degrading signal quality.
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