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Advanced Electronics Packaging Digest

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Qnity Showcases Materials Innovations Powering the Next Leap in Electronics at TPCA Show 2026

10/05/2026 | Qnity 
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, will showcase its portfolio at TPCA Show on Oct. 20–22 at the Taipei Nangang Exhibition Center.

EMD Electronics Opens Wisconsin R&D Facility for Semiconductor Materials

10/02/2026 | Globe Newswire
EMD Electronics, the North America electronics business of Merck KGaA, Darmstadt, Germany, announced the opening of a new 38,000-square-foot research and development facility at its Sheboygan Falls, Wisconsin site, expanding the company’s ability to develop and scale advanced materials for next-generation semiconductor manufacturing.

It’s Only Common Sense: When the Cheapest Board Becomes the Most Expensive

10/04/2026 | Dan Beaulieu -- Column: It's Only Common Sense
There is an old saying that price is what you pay, while cost is what you live with, a truism in the PCB industry, where too many companies still purchase PCBs by placing three quotations side by side and automatically choosing the lowest number. On the surface, that looks like responsible purchasing, but was it really a victory?

HBM, Advanced Packaging and Cooling Market Set for Growth Through 2037

09/30/2026 | Globe Newswire
High-bandwidth memory (HBM) and advanced packaging materials are becoming critical components of the artificial intelligence semiconductor supply chain.

Indium Experts to Present Advanced Packaging, AI, and High-Performance Computing Materials Solutions at IMAPS Symposium

09/28/2026 | Indium Corporation
As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing advanced packaging and high-power performance challenges at the IMAPS Symposium 2026, September 29-October 1, in Boston, Massachusetts.
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