December Edition of The PCB Magazine is Now Available
December 12, 2017 | I-Connect007Estimated reading time: Less than a minute

The December issue of The PCB Magazine has published and is now available.
Thermal Management: Keeping off the hot seat
Increasing consumer demands for high performance and the need for high reliability in sectors such as automotive, LED lighting and renewable energy mean that thermal management is now front and center on the priority list for PCB manufacturing. This month, industry experst are in the hot seat to explain how to keep everything cool.
Read all about it this month in The PCB Magazine, now on the PCB007 virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
You can also download the pdf version to your devices for future reference.
Suggested Items
Indium Promotes O’Leary to Director of Global Accounts
05/27/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to electronics, semiconductor, thin-film, and thermal management industries, announces the promotion of Brian O’Leary to Director of Global Accounts.
Robert C. Donovan Joins DISTRON, Marking the Third Generation in Family Leadership
05/26/2025 | Distron Corp.DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, proudly announces that Robert C. Donovan, son of CEO Robert H. Donovan and grandson of Founder Robert G. Donovan, has joined the company as a Management Trainee. This milestone marks the beginning of the third generation of family leadership at the company.
Siemens to Bring Advanced Timing Constraint Capabilities to EDA Design Flow with Excellicon Acquisition
05/19/2025 | SiemensSiemens has entered into an agreement to acquire Excellicon to bring its best-in-class software for the development, verification, and management of timing constraints to Siemens’ EDA portfolio of software for IC design
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
Laird Thermal Systems Unveils New Identity
05/05/2025 | Laird Thermal SystemsLaird Thermal Systems, a global leader in active thermal management solutions with more than 60 years of application expertise, today announced its rebrand to Tark Thermal Solutions.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in