Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Geospace Unveils New Brand Identity Reflecting the Company’s Move into Diverse Markets

05/20/2025 | BUSINESS WIRE
Geospace Technologies Corporation announces a new brand identity, reflecting the company's transformation of its leadership and culture along with a redefined strategy focused on applied intelligent technology.

Yank Technologies Selected for Prestigious NASA Phase II Contract for Dust-Tolerant Resonant Connectors

05/20/2025 | PRNewswire
Yank Technologies, the developer of disruptive long range, high power wireless charging solutions, has been selected for a two-year follow-on Small Business Innovation Research (SBIR) Phase II contract from the National Aeronautics and Space Administration (NASA) to advance Dust-Tolerant Resonant Connectors for lunar and planetary surfaces.

Mycronic High Flex Changes Division Name to PCB Assembly Solutions

05/20/2025 | Mycronic
Mycronic AB, the leading Sweden-based electronics assembly solutions provider, announced that its division formerly known as High Flex will now operate under the name PCB Assembly Solutions.

Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025

05/19/2025 | Indium Corporation
As a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.

Harnessing Connections: EWPTE 2025 Draws Nearly 3,000 Attendees

05/19/2025 | IPC
The 2025 Electrical Wire Processing Technology Expo (EWPTE), held May 6-8 at Baird Center in Milwaukee, Wis., provided 2,994 attendees the opportunity to meet, network and learn from the industry leading innovators and suppliers.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in