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Orbotech Presented Ultra Dimension Series at HKPCA 2017
December 28, 2017 | OrbotechEstimated reading time: 3 minutes
Orbotech Ltd. presented its new Ultra Dimension AOI (Automated Optical Inspection) series at the recent PCB industry HKPCA 2017 show in Shenzhen, China. The Ultra Dimension was showcased in a model AOI room along with the Precise 800 AOS (Automated Optical Shaping), remote multi-image verification (RMIV) station and Orbotech Data Server, attracting approximately 500 visitors during the three days of the show. In addition, Orbotech also presented its Nuvogo Fine Direct Imaging solution, as well as Orbotech Smart Factory solution for Industry 4.0 and Frontline’s CAM and Engineering solutions.
Designed to meet the rigorous demands of advanced PCB manufacturing using SLP/mSAP (substrate-like PCB/modified semi-additive process), the innovative Ultra Dimension is the first AOI solution to integrate four leading systems into one. The solution, which includes pattern inspection, laser via inspection, Remote Multi-Image Verification and 2D metrology, signifies a revolution in the AOI room workflow and enables manufacturers to increase quality and yield while dramatically reducing their overall total cost of ownership (TCO).
“Orbotech’s new AOI room concept together with our new Ultra Dimension, attracted positive attention at HKPCA,” commented Hadar Himmelman, President of Orbotech Pacific. “The feedback that we received on our new 4-in-1 AOI solution is that it represents a real revolution in the AOI room workflow. Together with its ability to reduce TCO, the Ultra Dimension meets our customers’ needs as the market becomes more sophisticated.
”Ultra Dimension’s combination of high precision and high quality pattern inspection and laser via (LV) inspection in a single scan is powered by Orbotech’s proprietary Triple Vision Technology and Magic Technology. By using varied light settings and three different types of images, these technologies enable Ultra Dimension to improve detection capabilities significantly, reduce false alarms and decrease inspection set-up time. This, in turn, allows manufacturers of advanced PCBs using SLP/mSAP (substrate-like PCB/modified semi-additive process) the flexibility to inspect a variety of applications and materials, and eliminates the need to use inspection masks which can cause defects to be overlooked.
Orbotech’s 2D metrology automatically measures both top and bottom conductor widths for lines and pads of a wide variety of shapes, enabling the higher accuracy and impedance control necessary for SLP/mSAP as well as advanced HDI applications.
Orbotech’s Remote Multi-Image Verification (RMIV) enables the remote verification of multiple image defects, which are automatically and simultaneously acquired during the inspection process. Orbotech’s unique multi-image technology enables operators to accurately differentiate between real and false defects, which are then sent to offline RMIV stations. Ultra Dimension with RMIV also reduces the number of verification stations required, thereby freeing up valuable floor space in the AOI room and allowing manufacturers to cut their overall labor and operational costs significantly.
For the second year running, Orbotech won a prize for booth design from the HKPCA Association. The prize was awarded at a gala dinner event during the show.
About Orbotech Ltd.
Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality (‘reading’); pattern the desired electronic circuitry on the relevant substrate and perform three-dimensional shaping of metalized circuits on multiple surfaces (‘writing’); and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing (‘connecting’). Orbotech refers to this ‘reading’, ‘writing’ and ‘connecting’ as enabling the ‘Language of Electronics’. For more information, click here.
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