PCBCart Exhibits at NEPCON Japan
January 19, 2018 | PCBCartEstimated reading time: 1 minute

PCBCart exhibited at the NEPCON 47th Electronics R&D and Manufacturing Technology Expo in Tokyo, Japan.
During NEPCON Expo January 17-19, PCBCart displayed comprehensive classifications of the most advanced PCBs including Aluminum PCBs laminated with FR-4, PTFE high-frequency PCBs, ultra-thick PCBs, HDI PCBs with two steps, HDI flex-rigid PCBs, and multilayer mixed-laminate PCBs. Those products result from combinations of different top PCB fabrication technologies to meet increasingly higher demands of modern electronic products.
Apart from PCB fabrication, visitors also got access to PCB assembly and components sourcing capabilities of PCBCart. At PCBCart’s booth, customers learned about PCB assembly applications in electronic products serving industries of medical care, telecommunications, military, automotive, and consumer electronics. based on successful cases in the past over 10 years’ development. High-tech SMT assembly samples were also displayed with advanced assembly capabilities such as SMD 01005, fine-line BGA, QFN or WLCSP mounting, press fit, POP etc. Furthermore, standardized steps of components sourcing, inspection and storage principles were introduced to visitors as well during expo.
The NEPCON Expo showcased PCBCart’s partial market focus on PCB solutions, from PCB fabrication, PCB assembly to components sourcing. NEPCON Expo is Asia’s largest electronic show, which is held twice a year and will be held in September 2018 in Nagoya, Japan. Primary expo segments on display at NEPCON include electrotest, IC and sensor packaging technology, electronic components and materials, PWB, fine process technology, and LED and laser diode technology.
PCBCart is a worldwide electronic manufacturing service provider specializing in end-to-end electronic solutions. The primary services of PCBCart contain co-designing, DFM/DFA check, quick turn prototyping, SMT assembly, box build, quality control, NPI, and supply chain management.
For more detailed information about PCBCart, please visit www.pcbcart.com.
Suggested Items
Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
05/30/2025 | FoxconnThe research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.
Meyer Burger Shuts Down Solar Module Production, Lays Off 282 Employees in the U.S.
05/30/2025 | Meyer BurgerMeyer Burger Technology AG is forced to stop its solar module production in the U.S., which is still ramping up, due to a lack of funds. On May 29, 2025, all 282 remaining employees at the Goodyear, Arizona, site received their notices of termination. Production with an annual capacity of 1.4 gigawatts was shut down immediately.
VJ Electronix Appoints Marco Cruz as Mexico Regional Sales Manager
05/30/2025 | VJ ElectronixVJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce the appointment of Marco Antonio Cruz Tovar as Mexico Regional Sales Manager.
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIREGlobal technology solutions provider Arrow Electronics has received two prestigious awards from Dell Technologies: 2025 OEM Solutions Partner of the Year and 2025 North America Distributor of the Year. The awards were announced at Dell Technologies World, held in Las Vegas in late May.
Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems
05/27/2025 | ImecAt the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.