Electronics in Harsh Environments Conference Program Finalized
February 6, 2018 | SMTAEstimated reading time: 1 minute
SMTA Europe is excited to announce the finalized program for Electronics in Harsh Environments Conference. The event will be held April 24-26, 2018 at the Crowne Plaza Amsterdam – Schiphol in Amsterdam, Netherlands.
This global conference is a strong two and a half day technical event focused on building reliable electronics used in power electronics and harsh environments. Conference sessions will include Predicting Component Life, Joining Technologies, Electrochemical Reliability, Adhesive and Coating, Advanced Test Methods, Automotive Environments and High Temperature PCB Materials and Fabrication.
Two half-day workshops will open the conference on Tuesday, April 24, 2018. The morning workshop is, “Understanding Shock & Vibration” and Alex Feinberg, Ph.D., DfR Software, will instruct the course. Martin Wickham, National Physical Laboratory, will instruct the workshop "Increasing the Performance of Organic PCBs at Higher Temperatures Workshop" in the afternoon.
On Wednesday, April 25, Ralph C. Tuttle, Cree, Inc., will provide his keynote presentation on “High Power LED Solder Joint Reliability.”
On Thursday, April 26, the program will focus primarily on automotive applications. Dwight Howard, APTIV (formerly Delphi Automotive), will provide his keynote presentation on “Automotive Electronics: Durability in the Face of Harsh Environments.” The afternoon session, co-organized by iNEMI, will feature a presentation, panel discussion, and breakout groups.
A co-located table-top expo will showcase additional solutions from leading companies focused on improving reliability for electronics operating in harsh environments. The expo will run April 24-26, concurrently with the conference.
Register to become a SMT Processes Certified Engineer at the Electronics in Harsh Environments Conference. Each SMTA Certification program is a three-day offering consisting of a 1.5-day workshop on topics in SMT Processes. The program concludes on days two and three with an open and closed book examination.
About SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in