MEMS Chips Get Metalenses
February 21, 2018 | AMERICAN INSTITUTE OF PHYSICSEstimated reading time: 2 minutes

Lens technologies have advanced across all scales, from digital cameras and high bandwidth in fiber optics to the LIGO lab instruments. Now, a new lens technology that could be produced using standard computer-chip technology is emerging and could replace the bulky layers and complex geometries of traditional curved lenses.
Flat lenses, unlike their traditional counterparts, are relatively lightweight, based on optical nanomaterials known as metasurfaces. When the subwavelength nanostructures of a metasurface form certain repeated patterns, they mimic the complex curvatures that refract light, but with less bulk and an improved ability to focus light with reduced distortion. However, most of these nanostructured devices are static, which limits their functionality.
Federico Capasso, an applied physicist at Harvard University who pioneered metalens technology, and Daniel Lopez, group leader of nanofabrication and devices at Argonne National Laboratory and an early developer of microelectromechanical systems (MEMS), brainstormed about adding motion capabilities like fast scanning and beam steering to metalenses for new applications.
Capasso and Lopez developed a device that integrates mid-infrared spectrum metalenses onto MEMS. The researchers report their findings this week in APL Photonics, from AIP Publishing.
MEMS is a circuit-based technology that incorporates microelectronics, like those found in computer chips, and includes mechanical microstructures like actuators and gears. Ubiquitous in everything from cellphones to airbags, biosensing devices, appliances and optics, MEMS are fabricated using the same techniques used for integrated circuits on typical computer chips.
"Dense integration of thousands of individually controlled lens-on-MEMS devices onto a single silicon chip would allow an unprecedented degree of control and manipulation of the optical field," Lopez Said.
The researchers formed the metasurface lens using standard photolithography techniques on a silicon-on-insulator wafer with a 2-micron-thick top device layer, a 200-nanometer buried-oxide layer, and a 600-micron-thick handle layer. Then, they placed the flat lens onto a MEMS scanner, essentially a micromirror that deflects light for high-speed optical path length modulation. They aligned the lens with the MEMS' central platform and fixed them together by depositing small platinum patches.
"Our MEMS-integrated metasurface lens prototype can be electrically controlled to vary the angular rotation of a flat lens and can scan the focal spot by several degrees," Lopez said. "Furthermore, this proof-of-concept integration of metasurface-based flat lenses with MEMS scanners can be extended to the visible and other parts of the electromagnetic spectrum, implying the potential for application across wider fields, such as MEMS-based microscope systems, holographic and projection imaging, LIDAR (light detection and ranging) scanners and laser printing."
When electrostatically actuated, the MEMS platform controls the angle of the lens along two orthogonal axes, allowing the scanning of the flat lens focal spot by about 9 degrees in each direction. The researchers estimate that the focusing efficiency is about 85 percent.
"Such metalenses can be mass produced with the same computer-chip fabrication technology and in the future, will replace conventional lenses in a wide range of applications," Capasso said.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.
AI-Powered Wearables Transform How Consumers Interact with Everyday Technology
09/15/2025 | PR NewswireThe global demand for AI-driven, touchless wearable technologies is accelerating as consumers seek more natural, seamless and intuitive ways to interact with their devices. Traditional touch screens and voice assistants, while effective, are increasingly viewed as limiting in a world where multitasking, mobility and efficiency are key. As industries from consumer electronics to augmented reality and enterprise computing embrace the possibilities of gesture-based control, the market for neural interfaces is rapidly expanding
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.