Modified, 3D-Printable Alloy Shows Promise for Flexible Electronics, Soft Robots
March 8, 2018 | Oregon State UniversityEstimated reading time: 2 minutes
Researchers in Oregon State University’s College of Engineering have taken a key step toward the rapid manufacture of flexible computer screens and other stretchable electronic devices, including soft robots.
The advance by a team within the college’s Collaborative Robotics and Intelligent Systems Institute paves the way toward the 3D printing of tall, complicated structures with a highly conductive gallium alloy.
Researchers put nickel nanoparticles into the liquid metal, galinstan, to thicken it into a paste with a consistency suitable for additive manufacturing.
“The runny alloy was impossible to layer into tall structures,” said Yiğit Mengüç, assistant professor of mechanical engineering and co-corresponding author on the study. “With the paste-like texture, it can be layered while maintaining its capacity to flow, and to stretch inside of rubber tubes. We demonstrated the potential of our discovery by 3D printing a very stretchy two-layered circuit whose layers weave in and out of each other without touching.”
Gallium alloys are already being used as the conductive material in flexible electronics; the alloys have low toxicity and good conductivity, plus they’re inexpensive and “self-healing” – able to attach back together at break points.
But prior to the modification developed at OSU, which used sonication – the energy of sound – to mix the nickel particles and the oxidized gallium into the liquid metal, the alloys’ printability was restricted to 2-dimensional.
For this study, researchers printed structures up to 10 millimeters high and 20 millimeters wide.
“Liquid metal printing is integral to the flexible electronics field,” said co-author Doğan Yirmibeşoğlu, a robotics Ph.D. student at OSU. “Additive manufacturing enables fast fabrication of intricate designs and circuitry.”
The field features a range of products including electrically conductive textiles; bendable displays; sensors for torque, pressure and other types of strain; wearable sensor suits, such as those used in the development of video games; antennae; and biomedical sensors.
“The future is very bright,” Yirmibeşoğlu said. “It’s easy to imagine making soft robots that are ready for operation, that will just walk out of the printer.”
The gallium alloy paste demonstrates several features new to the field of flexible electronics, added co-corresponding author Uranbileg Daalkhaijav, Ph.D. candidate in chemical engineering.
“It can be made easily and quickly,” Daalkhaijav said. “The structural change is permanent, the electrical properties of the paste are comparable to pure liquid metal, and the paste retains self-healing characteristics.”
Future work will explore the exact structure of the paste, how the nickel particles are stabilized, and how the structure changes as the paste ages.
The Office of Naval Research Young Investigator Program supported this research.
About the OSU College of Engineering
The OSU College of Engineering is among the nation's largest and most productive engineering programs. Since 1999, the college has more than tripled its research expenditures to $37.2 million by emphasizing highly collaborative research that solves global problems. It is a leader in signature research areas, including precision health, clean energy, resilient infrastructure and advanced manufacturing; and targeted strategic areas, including robotics, materials research and clean water.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
OE‑A Publishes 10th Edition of the Roadmap for Flexible and Printed Electronics
04/22/2026 | OE-AWith the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry.
Global Flexible PCB Market to Nearly Double, Reaching $41.7 Billion by 2030
04/03/2026 | Globe NewswireThe global flexible printed circuit board (FPCB) market is projected to grow from $21.5 billion in 2024 to $41.7 billion by 2030, reflecting a compound annual growth rate (CAGR) of 12.3%, according to a new report from BCC Research.
China’s Top 3 FPC Manufacturers 2026: Advancing Sustainable Flexible Electronics
03/25/2026 | EINPresswire.comThe global transition towards compact, lightweight, and durable electronic devices is accelerating demand for advanced Flexible Printed Circuits (FPCs).
SMT Renting: Redefining Equipment Investment
03/24/2026 | Marcy LaRont, I-Connect007SMT Renting, based in Copenhagen, is challenging the traditional machine-ownership model with a flexible, service-based approach. Business Manager Christian Thers discusses how rental options, “stop and swap” flexibility, and a new pay-per-placement model help electronics manufacturers reduce risk and adapt quickly in an unpredictable market.
Global Market for Flexible Manufacturing Systems Set to Surge to $22.2 Billion by 2030
03/02/2026 | GlobeNewswireAccording to the latest study from BCC Research, “Global Market for Flexible Manufacturing Systems” is expected to increase from $15.2 billion in 2025 to $22.2 billion by the end of 2030, at a compound annual growth rate (CAGR) of 7.9% from 2025 through 2030.