Marine Exploration Sensing With Light and Sound
March 12, 2018 | KAUSTEstimated reading time: 1 minute

Oceanic sensor networks that collect and transmit high-quality, real-time data could transform our understanding of marine ecology, improve pollution and disaster management, and inform the multiple industries that draw on ocean resources. A KAUST research team is designing and optimizing underwater wireless sensor networks that could vastly improve existing ocean sensing equipment.
“Currently, underwater sensors use acoustic waves to communicate data,” explains Nasir Saeed, who is working on a new hybrid optical-acoustic sensor design with colleagues Abdulkadir Celik, Mohamed Slim Alouini and Tareq Al-Naffouri. “However, while acoustic communication works over long distances, it can only transmit limited amounts of data with long delays. Recent research has also shown that noise created by humans in the oceans adversely affects marine life. We need to develop alternative, energy-efficient sensors that limit noise pollution while generating high-quality data.”
One option is to use optical communication technology instead, but light waves will only travel short distances underwater before they are absorbed. Optical sensors also rely heavily on pointing and tracking mechanisms to ensure they are correctly orientated to send and receive signals. The team therefore propose a hybrid sensor capable of transmitting both acoustic and optical signals simultaneously. In this way, a data-collection buoy on the water surface can communicate with every sensor in a network spread out beneath it.
However, marine research requires accurate measurements taken from precise locations, so scientists need to know where every sensor is at any given time. The team used mathematical modeling to develop a proof-of-concept localization technique.
“Using our technique, the sensors transmit their received signal strength information (RSSI) to the surface buoy,” says Saeed. “For a large communication distance, the sensors use acoustic signals, but if the sensor is within close range of another sensor, it will send an optical signal instead.”
Multiple RSSI measurements for each sensor are collected by the surface buoy. The buoy then weights these measurements to give preference to the most accurate readings before calculating where each sensor is positioned.
Alouini's and Al-Naffouri's teams propose that their sensors will require a new energy source rather than relying on short-term battery power. They envisage an energy-harvesting system that powers fuel cells using microscopic algae or piezoelectric (mechanical stress) energy.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Procense Raises $1.5M in Seed Funding to Accelerate AI-Powered Manufacturing
09/11/2025 | BUSINESS WIREProcense, a San Francisco-based industrial automation startup developing cutting-edge AI and remote sensing technologies for process manufacturers has raised $1.5 million in a seed funding round led by Kevin Mahaffey, Business Insider’s #1 seed investor of 2025 and HighSage Ventures, a Boston-based family office that primarily invests in public and private companies in the global software, internet, consumer, and financial technology sectors.
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
AI Infrastructure Boosts Global Semiconductor Revenue Growth to 17.6% in 2025
09/09/2025 | IDCAccording to the Worldwide Semiconduct o r Technology and Supply Chain Intelligence service from International Data Corporation (IDC), worldwide semiconductor revenue is expected to reach $800 billion in 2025, growing 17.6% year-over-year from $680 billion in 2024. This follows a strong rebound in 2024, when revenue grew by 22.4% year-over-year.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.