U.S. Lead Demand to Reach 1.5 Million Metric Tons in 2022
March 16, 2018 | PRNewswireEstimated reading time: 1 minute
US lead demand is forecast to reach 1.5 million metric tons in 2022, according to Lead: United States, a report recently released by Freedonia Focus Reports. Suppliers are expected to benefit from rising U.S. output of lead-acid batteries, propelled by expected growth in motor vehicle production and the number of motor vehicles in use.
Lead demand in batteries is projected to continue representing the largest segment in 2022. Expanding motor vehicle production in the NAFTA region will increase US output of lead-acid batteries. In addition, rising numbers of motor vehicles in use will drive growth in the market for replacement batteries. Furthermore, increasing investment in renewable energy and power grid storage, uninterruptible power supply systems, and telecommunications will support growth for stationary batteries.
These and other key insights are featured in Lead: United States. This report forecasts to 2022 US lead demand and production in metric tons of lead content. Total demand is segmented by application in terms of:
- batteries
- metal products
- other applications such as glass and ceramic products, paint, and chemicals
The following measures of US lead production, in metric tons of lead content are also forecast to 2022:
- mine production
- secondary refinery production
To illustrate historical trends, total demand; mine, primary refinery, and secondary refinery production; the various demand segments; and trade are provided in annual series from 2007 to 2017.
About Freedonia Focus Reports
Each month, The Freedonia Group – a division of MarketResearch.com – publishes over 20 new or updated Freedonia Focus Reports, providing fresh, unbiased analysis on a wide variety of markets and industries. Published in 20-30 pages, Focus Report coverage ranges from raw materials to finished manufactured goods and related services such as freight and construction.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Leadership Change at Koh Young Europe
08/14/2025 | Koh YoungAfter 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step down from his executive role.
TTM Technologies, Inc. Announces Retirement Plans of its CEO and Proceeds with CEO Successor Search
08/04/2025 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (“PCB”), today announced that Thomas T. Edman, the company’s President and Chief Executive Officer, intends to retire following the appointment of the company’s next President and CEO.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.