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Advanced Electronics Packaging Digest

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Suggested Items

Base Material Properties and Microvia Reliability

07/01/2026 | Ed Kelley, Victory Giant Technology
The drive toward higher circuit density is challenging PCB manufacturers and their supply chains alike, with base materials as a critical foundation for complex designs. HDI designs present specific challenges and requirements for these materials, but given the myriad possible designs and applications, there is no optimal “one size fits all” material. Perhaps the most challenging HDI designs are those that use stacked vs. staggered microvias, with the number of layers of stacked microvias and the pitch between them as critical variables.

Nolan’s Notes: The ROI of Setup Optimization

07/02/2026 | Nolan Johnson -- Column: Nolan's Notes
It was a comment from a guest at APEX EXPO last March that hit me. We were walking the show floor together and I was describing the major pieces of equipment, their functions, and the order of operation. When we stopped at a booth with robotic component towers, my guest commented, “So, everyone has one of these, right?” “Umm, no,” I said. “This is considered pretty sophisticated equipment. A lot of companies pick these parts from inventory by hand.” My guest, an industry outsider, said, “How do they tolerate all the time and human error?” That response, frankly, was rather devastating. She may have been new to the industry, but she sure knew a thing or two about manufacturing. I said to myself, “Is it really that obvious?”

Right-sizing Silver: An Application-driven Approach to Engineering Reliability

06/24/2026 | Ebad Rehman, MacDermid Alpha Electronics Solutions
Rising cost pressure and metals market uncertainty are prompting manufacturers to rethink alloy composition to balance total cost of ownership, process yield, and mechanical performance. Solder alloy selection directly influences cost structure, process stability, and long‑term reliability in electronics assembly. As manufacturing scales and product requirements advance, these decisions are increasingly revisited with a more focused objective: aligning materials with how products are built, processed, and used in real‑world conditions.

Fresh PCB Concepts: Engineering Copper Coin and Copper Pedestal Technology With IPC Design Interpretation

06/25/2026 | Team NCAB -- Column: Fresh PCB Concepts
Copper coin and copper pedestal technologies have become increasingly important in modern PCB design as thermal demands rise in power electronics, automotive systems, RF applications, aerospace electronics, and high-density computing environments. As component power density increases and board sizes shrink, traditional thermal management techniques often become insufficient to maintain acceptable operating temperatures and long-term reliability.

Knocking Down the Bone Pile: The Business Case for Component Reclamation

06/23/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Electronic waste is increasing globally at an alarming rate. By 2030, it is estimated that the world will generate approximately 82 million tons of electronic waste per year. Rapid technological advances, shorter product lifecycles, and supply chain disruptions often lead manufacturers to build bloated inventories of electronic products. Unfortunately, some of this inventory ends up as electronic waste when components become obsolete or surplus to forecasted requirements, including high-value devices.
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