Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
EIPC SpeedNews: News from the European PCB Industry
March 28, 2018 | EIPCEstimated reading time: Less than a minute
- Call for Papers EIPC 50th Anniversary Conference: June 21–22, 2018, Dusseldorf, Germany
- Call for Papers 26th FED Conference September 27–28, 2018, Bamberg, Germany
- Neoganth W Pre Dip: Atotech’s New Horizontal Activator Pre Dip for Fine Line Applications
- Schweizer Electronic AG: Preliminary Unaudited Group Figures for FY2017
- Aegis Software Announces Partnership with Seica Italy, Taking Digitalization in Europe Forward
- IMAPS, A Half Day Workshop on Monday, April 9, 2018
- 2018 ICT Annual Foundation Course, Chester University, April 9–12, 2018
- Custer Consulting Group
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/11/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.
Machvision Leads Shift to Automated Inline Final Inspection, AOI in North America
09/10/2025 | Ralph Jacobo, all4-PCBSchweitzer Engineering Laboratories (SEL) chose Machvision inspection equipment due to its capabilities and versatility. Machvision of Taiwan offers circuit inspection, hole inspection and measurement, IC Substrate and HDI inspection, and final visual inspection solutions. The best fit for SEL was the 4.0Pro Circuit Inspection for inner and outer layers, and the AFI6 for final visual inspection of finished panels.