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What is Happening in the Panel Level Packaging Industry?
April 27, 2018 | Yole DéveloppementEstimated reading time: 1 minute
The demand for lower cost plus higher performance, coupled with OSAT /assembly house end-customers’ desire for increasingly lower prices, has driven the semiconductor industry to develop innovative solutions. One approach to reducing overall cost is to move to a larger-size panel format. This technology, named Panel Level Packaging (PLP) takes advantage of efficiency and economies of scale.
In this favorable context, the market research and strategy consulting company Yole Développement (Yole), announces a $285 million market in 2023, showing a 51% CAGR during the 2017-2023 period.
Detailed technology & market analysis focused on the PLP technology and market is today available in the latest advanced packaging report from Yole: Status of Panel Level Packaging 2018. This report is an update of a 2015 edition. During three years, Yole’s analysts pursue their investigation to identify the related issues and understand the evolution of this market. Why does the industry need PLP solutions today? What are the technology challenges? What the status of the development?... Yole’s team proposes today a comprehensive study including a detailed description of the current solutions per player with technical and market data as well as the analysis of PLP business opportunities.
“At Yole, we identify a sustained interest in the industry towards PLP solutions since 2015, to avail cost reductions,” explains Santosh Kumar, Senior Technology & Market Research Analyst at Yole. “This approach has clearly the ability to change the advanced packaging landscape. This is why lot of leading companies, especially equipment and material suppliers, have entered this business. Today, players are closely watching the PLP developments to explore opportunities and position themselves strategically to increase its competitive advantage.”
Many packaging platforms can be considered panel-based. Under Yole’s report, two major packaging technologies have been considered to be PLP, where both RDL interconnect fabrication and further assembly are done at panel level. They are: FOPLP and embedded die.
Lot of players have been developing FOPLP technology, but after years of development, qualification and sampling, three players will finally enter in production in 2018, announces Yole in its new PLP report: PTI – NEPES - SEMCO. NEPES has been in low-volume production since 2017. ASE, in partnership with Deca Technologies, is in the advanced development stage and will commence volume production in 2019/2020.
Each player has its own business strategy and is working on its own FOPLP technology including panel size, leveraging different infrastructure, etc.
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