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Advanced Electronics Packaging Digest

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ACCM Expands US Manufacturing Capacity for AI Infrastructure

09/28/2026 | BUSINESS WIRE
Advanced Chip and Circuit Materials, Inc. (ACCM) announced a major expansion of its US manufacturing capacity for the Celeritas® family of advanced dielectric materials, covering the four segments of AI hardware where material supply and performance currently constrain system design: ultra-high-speed skew-free materials, low- and negative-expansion laminates for large accelerator boards, IC substrate/package core materials, and build-up materials.

ATLANT 3D, UC Berkeley Sign MoU to Advance Materials Innovation and A-HUB California

09/28/2026 | PRNewswire
ATLANT 3D and the University of California, Berkeley (UC Berkeley) have signed a Memorandum of Understanding to advance research, technology development, and innovation infrastructure in California.

Wolfspeed Expands 200 mm Silicon Carbide Portfolio with New Premium Power Substrates

09/28/2026 | BUSINESS WIRE
Wolfspeed, Inc., a global leader in silicon carbide (SiC) technology, announced the commercial availability of its new Premium 200 mm n-type silicon carbide substrate, expanding its 200 mm SiC materials portfolio with a higher-quality starting material designed to improve yield through reduced defects and greater wafer-shape stability.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/25/2026 | Michelle Te, I-Connect007
I recently discovered that the original “Star Trek” debuted in the same month I was born. You can look that up if you want to, but did you know that the series only ran for three years? During that time, however, they produced nearly 30 episodes per season, so there were more than 80 episodes to run through the many years of syndication, as was often the case for me after school: “Brady Bunch” at 4 p.m., “Gilligan’s Island” at 4:30, and then “Star Trek” at 5 p.m. I really tried to be interested in “Star Trek,” but it just felt too corny for me, although I’m not sure how much more “Gilligan’s Island” was rooted in reality.

Latest Episode of Qnity Podcast Series Explores Materials for Mission-Critical Reliability

09/25/2026 | I-Connect007
The second episode of Engineering What’s Next, a podcast series from Qnity, is now available on I-Connect007. The series explores the materials, technologies, and expertise shaping the next generation of electronics. In “Materials for Mission-Critical Reliability,” host Marcy LaRont speaks with Rich Wessel, Industrial Application Leader, Laminates, about the increasingly complex demands placed on materials as electronics move into more challenging and mission-critical applications.
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