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Advanced Electronics Packaging Digest

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Suggested Items

Xscindo: No Data, No Landfill, No Waste

09/23/2026 | Marcy LaRont, I-Connect007 Magazine
Xscindo is a start-up recycling company developing an alternative approach to conventional e-waste processing, focusing on transforming discarded electronics into clean, recoverable critical and precious metals rather than losing them to traditional disposal and recycling streams. Xscindo's work sits at the intersection of circularity, resource security, and a rapidly expanding need for critical materials, and speaks to a much larger challenge facing the electronics industry: finding better ways to keep valuable resources in circulation rather than exporting them. In this interview, Aiden Neary, founder and CEO, tells us more about this important work.

An Open Invitation to Standards Development in Paris

09/14/2026 | Marcy LaRont, I-Connect007
The Global Electronics Association is doing something a little different around standards this year. IPC Builds, Sept. 19–24, in Paris, is a series of standards development meetings open to both Association members and nonmembers, offered at no charge, with lunch provided. Sponsoring an event like this at no charge caught my attention. Removing any registration cost clearly removes a barrier to participation at a time when global input into standards development is needed more than ever. An open forum naturally makes it easier for someone who is curious about standards work or has wanted to get involved but hasn’t yet taken the first step to experience the process firsthand, with no risk or expectation.

Evaluating Physical Process Parameters to Improve Copper Plating Distribution

09/11/2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change.

Dan’s Biz Bookshelf: Revisiting 'The Popcorn Report'

08/20/2026 | Dan Beaulieu -- Column: Dan's Biz Bookshelf
One of the things I enjoy most about reading is occasionally rereading books that made a big impression years ago. Sometimes they hold up beautifully, sometimes they don't, and sometimes they become even more interesting because time has given us a completely different perspective. That's exactly what happened when I recently picked up "The Popcorn Report" by Faith Popcorn, first published in 1991.

The Chemical Connection: Back to Basic Cupric Chloride Etching

07/08/2026 | Don Ball -- Column: The Chemical Connection
We have received several calls in the past few months from younger process people who have been thrust into more senior process positions as their older colleagues retire. They’ve realized they lack the practical knowledge their predecessors have accumulated over the years. They know what their various process parameters are, but not why those particular parameters were in place. I found that the most frequently asked questions have been about cupric chloride etch chemistries. Therefore, I will cover the very basics of cupric chloride etching; not so much the technical facts but why we give the advice we do.
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