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Advanced Electronics Packaging Digest

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Suggested Items

FCT Introduces Liquid Leak Detection Flex Assembly for AI and High-Performance Computing Systems

09/21/2026 | Flexible Circuit Technologies
Flexible Circuit Technologies Inc. (FCT) is pleased to announce the development of its Liquid Leak Detection Flex Assembly, a custom-engineered sensing solution designed for liquid-cooled AI servers, high-performance computing (HPC) systems, cold plates, manifolds, quick disconnects, coolant distribution units (CDUs), and other mission-critical electronics.

ASC Sunstone Circuits to Exhibit and Present Lunch-and-Learn at PCB West 2026

09/21/2026 | ASC Sunstone Circuits
ASC Sunstone Circuits will exhibit at PCB West 2026, taking place September 29 through October 2 at the Santa Clara Convention Center in Santa Clara, California. The PCB West exhibition will be held Wednesday, September 30.

Indium Promotes Chris Bastecki to Business Unit Vice President

09/11/2026 | Indium Corporation
Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed Circuit Board (PCB) Assembly Materials Marketing.

RapidDirect Launches PCB Division to Integrate PCB and Mechanical Manufacturing

09/11/2026 | Globe Newswire
RapidDirect, a leading global provider of custom on-demand digital manufacturing, announced the official launch of its new Printed Circuit Board (PCB) division.

Heller and SEHO Investing in Mexico

09/09/2026 | Nolan Johnson, SMT007 Magazine
Heller Industries is the leading provider of thermal systems in the electronics assembly and semiconductor industries, manufacturing a wide range of equipment, primarily for standard reflow applications in electronics assembly. The company has realized significant business growth in Mexico in recent years and is now preparing for SMTA Guadalajara. Paul Lancaster, vice president of sales and marketing, spoke about the Mexican market, growing a local support infrastructure, and partnering with SEHO.
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