Global Mobile DRAM Revenue Reached a New Record High in 1Q18
May 21, 2018 | TrendForceEstimated reading time: 4 minutes
DRAMeXchange, a division of TrendForce, reports that the smartphone market entered its traditional off-peak season earlier in the middle 4Q17 as the new devices released during 2H17 did not trigger a high level of replacement demand as anticipated. Smartphone brands had then spent three months adjusting their inventories before they again started to stock up on components toward the end of February 2018, when the end demand also began to bounce back. Much of the stock-up demand has been related to high-density memory components for new flagship smartphones that are to be released in 1H18. Revenue-wise, mobile DRAM suppliers in 1Q18 benefitted from new product releases, demand recovery in the smartphone market (since the middle of the quarter), and the increase in quotes. As a result, the global mobile DRAM revenue rose by 5.3% QoQ against seasonal headwinds to a new record high of US$8.435 billion.
The mobile DRAM market will be seeing a moderation of the price upswing in 2Q18. Nevertheless, demand from major Chinese smartphone brands, Huawei, Xiaomi, OPPO and Vivo, remains strong. Apple will raise the memory densities of iPhone models for 2018. Android phone makers, too, will do the same for their devices that are set for release this year. DRAMeXchange thus forecasts that the global mobile DRAM revenue will maintain QoQ growth in 2Q18 and again achieve a new record high.
Samsung was still the overall revenue leader in 1Q18. However, Samsung’s quoting has become more conservative during 1Q18 and 2Q18 compared with the prior quarters due to the investigation by China’s National Development and Reform Commission. To get around the constraints that are imposed on its pricing strategy, Samsung has been aggressively promoting high-density products together with its advanced manufacturing technology. Samsung was again at the top of the mobile DRAM revenue ranking for 1Q18 with a total of US$4.766 billion, as the company was successful in winning orders for high-density products. On the technology front, Samsung’s deployment of its 18nm process now extends to almost all of its mobile DRAM product lines. Only a few LPDDR3 eMCP lines are still produced on the older 20nm process.
SK Hynix’s mobile DRAM revenue for 1Q18 increased by just 2.2% QoQ despite the general upswing in contract prices. The marginal growth was attributed to the issues with raising the yield rate and production capacity of the 18nm process, which is still at the initial stage of development. Because of the challenges with the 18nm, SK Hynix could not increase its shipments of high-density LPDDR4 components for flagship smartphones in 1Q18. Currently, the 21nm process and the 25nm shrink process are still the main technologies that SK Hynix use for manufacturing LPDDR4 and LPDDR3 series, respectively. The portion of 18nm products in SK Hynix’s mobile DRAM portfolio (including discrete and eMCP) is not expected to increase noticeably until 3Q18. Also, the penetration rate of the 18nm technology in the manufacturing of the supplier’s mobile DRAM for the entire 2018 may be less than 10%.
Micron’s mobile DRAM revenue for 1Q18 went up by 10.2% QoQ to $1.408 billion, showing the largest increase among the top three suppliers. Micron’s impressive result was based on the strong overall demand and the persistent price upswing. In terms of technology development of Micron’s subsidiaries, Micron Memory Taiwan (formerly Rexchip) in 2Q18 will continue to increase the share of 17nm process in its mobile DRAM production. On the other hand, Micron Technology Taiwan (formerly Inotera) mainly produces mobile DRAM on the 20nm process for now. As for product planning, Micron’s mainstream offerings for the mobile application will soon make the switch from the LPDDR3 series to the LPDDR4 series, which is projected to represent more than 50% of the supplier’s total mobile DRAM output (including the output of both subsidiaries) for the whole 2018.
Regarding Taiwan-based suppliers, Nanya’s mobile DRAM revenue for 1Q18 advanced significantly by 19.1% QoQ to $96 million. Nanya expanded shipments of its LPDDR3 4Gb chips in 1Q18 because many IDHs (independent design houses) have chosen discrete packages (i.e. discrete DRAM plus discrete NAND Flash) over eMCPs due to considerations over BOM (bill of materials) costs. This in turn contributed to the strong revenue growth. In terms of technological development, Nanya is still mainly using the 30nm shrink process for the manufacturing of its mobile DRAM products. However, the company will expand the deployment its 20nm process in the mobile DRAM production in order to increase the profit margin. Winbond’s revenue performance was fairly stable in1Q18, registering a quarterly increase by 1.2% from 4Q17 to a total of US$44 million. Winbond’s mobile DRAM offerings are more limited in their application scopes, so the demand for them have not risen sharply.
About TrendForce
TrendForce is a global provider of the latest development, insight, and analysis of the technology industry. Having served businesses for over a decade, the company has built up a strong membership base of 435,000 subscribers. TrendForce has established a reputation as an organization that offers insightful and accurate analysis of the technology industry through five major research divisions: DRAMeXchange, WitsView, LEDinside, EnergyTrend and Topology. Founded in Taipei, Taiwan in 2000, TrendForce has extended its presence in China since 2004 with offices in Shenzhen and Beijing. For more information, click here.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.