CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology at SEMICON West
May 24, 2018 | CyberOptics CorporationEstimated reading time: 2 minutes
CyberOptics Corporation announces plans to exhibit at SEMICON West, scheduled to take place July 10-12, 2018 at the Moscone Center in San Francisco, California. The company will demonstrate its next-generation Airborne Particle Sensor (APS3) 300mm with new ParticleSpectrum software in Booth #6163.
CyberOptics’ WaferSense APS3 speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly detecting, identifying and monitoring airborne particles in real-time. With a thinner and lighter form factor to travel through semiconductor tools with ease, the APS3 offers leading accuracy and sensitivity valued by equipment and process engineers around the world.
The APS3 solution includes ParticleSpectrum software – a completely new, touch-enabled interface with user-friendly functionality, making it simple to read, record and review small to large airborne particle data. Easily identify when and where the particles originate and see the effects of cleanings, adjustments and repairs in real-time.
“We’ve taken what is documented as the best known method (BKM) for airborne particle sensing in semiconductor fabs to significantly improve yields and tool uptime, and made it even easier to use,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Engineers can monitor critical data from one, or multiple devices with an enhanced software application.”
CyberOptics’ Airborne Particle Sensors (APS) have proven to deliver up to 90% time savings, 95% expense reduction and up to 20X the throughput with half the manpower relative to legacy surface scan wafer methods.
Additionally, CyberOptics will display the new PanelSense™ Airborne Particle Sensor (APS-FPD) delivering the same valued benefits as the APS3, but designed specifically for the Flat Panel Display manufacturing market.
About the WaferSense, ReticleSense® and PanelSense Line
The WaferSense and ReticleSense measurement portfolio including the Auto Leveling System (ALS & ALSR), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensors (APS 2, 3, APSR & APSRQ) and the new Auto Multi Sensor (AMS & AMSR), are available in various wafer shaped and reticle shaped form factors depending on the device. The PanelSense measurement portfolio including the Airborne Particle Sensor (APS-FPD) is available in a flat panel display compatible form factor.
About CyberOptics
CyberOptics Corporation is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical segments. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
For more information about the entire line of CyberOptics solutions, click here.
Suggested Items
L3Harris Receives $214 Million in Orders to Support German Armed Forces
05/12/2025 | L3Harris TechnologiesL3Harris Technologies has received multiple orders expected to total $214 million under Germany’s Digitalization – Land Based Operations (D-LBO) program.
Cadence, AVCC to Advance Physical AI Innovations for Autonomous Vehicles
05/12/2025 | Cadence Design SystemsCadence has joined the Autonomous Vehicle Computing Consortium (AVCC), marking a significant step forward in Cadence's commitment to advancing autonomous vehicle technology for the physical AI era by working with industry leaders to define high-performance computing (HPC) and safety solutions for next-generation autonomous vehicle systems.
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
OSI Systems Receives $36 Million Contract for Aviation Security Systems
05/08/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received a contract award for approximately $36 million to deploy and service airport screening solutions for a prominent international airport in the Middle East.