Suggested Items
Aismalibar to Showcase Thermal Management Solutions for EV Battery Systems at The Battery Show North America 2024
09/27/2024 | AismalibarAismalibar, a leader in innovative thermal management materials, will be presenting its newest solutions for electric vehicle (EV) battery systems at The Battery Show North America from October 7-11, 2024. Located at Huntington Place, Detroit, MI, Aismalibar will exhibit at booth 6231, unveiling a range of cutting-edge Thermal Interface Materials (TIMs) designed to improve the safety, performance, and longevity of EV batteries.
Nano Dimension to Acquire Markforged, Leading AM Player
09/26/2024 | Nano DimensionNano Dimension Ltd. and Markforged Holding Corporation jointly announced that they have entered into a definitive agreement pursuant to which Nano Dimension will acquire all outstanding shares of Markforged in an all-cash transaction for $5.00 per share.
Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 4
09/25/2024 | I-Connect007 Editorial TeamDirect-bonded copper (DBC) with a ceramic base is a commonly used assembly technology. While advantages include excellent solder crack compensation due to similar CTE values between component and substrate, the construction is fragile and therefore places limits on size and exposure to vibration. Small assemblies in basic shapes such as a rectangle can be done, although larger, more complex shapes become difficult.
Indium Experts to Present Advanced Research at International Symposium on Microelectronics
09/20/2024 | IndiumIndium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.
iNEMI Packaging Tech Topic Webinar: Packaging Interconnect Material Technology Series
09/19/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) continues its Packaging Interconnect Material Technology Series with a webinar on Transient Liquid Phase (TLP) Bonding for High-Temperature Soldering Processes.