Quick Memory
August 10, 2018 | University of Texas at ArlingtonEstimated reading time: 2 minutes

Computer memory capacity has expanded greatly, allowing machines to access data and perform tasks very quickly, but accessing the computer’s central processing unit, or CPU, for each task slows the machine and negates the gains that a large memory provides.
Song Jiang, a UTA associate professor in the Department of Computer Science and Engineering, received an NSF grant to improve computer accessibility.
To counteract this issue, which is known as a memory wall, computers use a cache, which is a hardware component that stores recently accessed data that has already been accessed so that it can be accessed faster in the future. Song Jiang, an associate professor in the Department of Computer Science and Engineering at The University of Texas at Arlington, is using a three-year, $345,000 grant from the National Science Foundation to explore how to make better use of the cache by allowing programmers to directly access it in software.
“Efficient use of a software-defined cache allows quick access to data along with large memory. With memory becoming more expansive, we need to involve programmers to make it more efficient. The programmer knows best how to use the cache for a particular application, so they can add efficiency without making the cache a burden,” Jiang said.
When a computer accesses its memory, it must go through the index of all the data stored there, and it must do so each time it goes back to the memory. Each step slows the process. With a software-defined cache, the computer can combine or skip steps to access the data it needs automatically without having to go through the memory from the beginning each time. Jiang has studied these issues for several years and has developed four prototypes which he will test to determine if they can serve large memories without slowing CPU speeds at the same time.
The current trend in technology is toward using NVM or non-volatile memory. NVM is expected to be of much higher density, larger and less expensive, and will provide many terabytes of memory. Speeds will not change much, but the size will expand greatly, which will also increase the time necessary to go through the index. If Jiang is successful, speeds will keep pace with technology.
“As we ask our computer systems to work with increasingly large data sets, speed becomes an issue. Dr. Jiang’s work could provide a breakthrough in how software developers approach software-derived caches and, as a result, make it easier and less time-consuming to analyze big data,” Hong Jiang said.
Written by Jeremy Agor
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Procense Raises $1.5M in Seed Funding to Accelerate AI-Powered Manufacturing
09/11/2025 | BUSINESS WIREProcense, a San Francisco-based industrial automation startup developing cutting-edge AI and remote sensing technologies for process manufacturers has raised $1.5 million in a seed funding round led by Kevin Mahaffey, Business Insider’s #1 seed investor of 2025 and HighSage Ventures, a Boston-based family office that primarily invests in public and private companies in the global software, internet, consumer, and financial technology sectors.
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
AI Infrastructure Boosts Global Semiconductor Revenue Growth to 17.6% in 2025
09/09/2025 | IDCAccording to the Worldwide Semiconduct o r Technology and Supply Chain Intelligence service from International Data Corporation (IDC), worldwide semiconductor revenue is expected to reach $800 billion in 2025, growing 17.6% year-over-year from $680 billion in 2024. This follows a strong rebound in 2024, when revenue grew by 22.4% year-over-year.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.