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RTX's Raytheon Awarded $646M Hardware Production and Sustainment Contract for SPY-6 Family of Radars

06/10/2025 | RTX
Raytheon, an RTX business, was awarded a $646 million contract to continue producing AN/SPY-6(V) radars for the U.S. Navy. This is the fourth option exercised from the March 2022 hardware, production and sustainment contract that is valued up to $3 billion over five years.

ASMPT Presents High-performance LED Die Bonder

02/18/2025 | ASMPT
ASMPT, the world's leading supplier of hardware and software for semiconductor and electronics manufacturing, presents Vortex II, a high-performance die bonder for the production of mini LED displays, such as those used in the automotive industry.

Automating Test Processes in Modern PCBA Manufacturing

11/12/2024 | Josh Casper, Horizon Sales
ICT and functional test play critical roles in the electronics manufacturing process. In many cases, these processes are the final line of defense in identifying defects, preventing failures from reaching the end user, and safeguarding a manufacturer's reputation. A growing problem in this area has been the sheer increase in production output from the SMT line. As components get smaller, PCBs will continue shrinking, allowing engineers to design highly panelized products.

TPY-4 Radar Completes Successful Risk Reduction Tests, 3DELRR program one step closer to battlefield success

09/17/2024 | Lockheed Martin
The U.S. Air Force Three-Dimensional Expeditionary Long Rang Radar (3DELRR) program team and Lockheed Martin successfully accomplished risk reduction testing for the TPY-4 radar.  This event demonstrated the radar’s performance in a variety of conditions.

Indium Corporation Introduces Au-Based Precision Die-Attach Preforms

07/17/2024 | Indium Corporation
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.
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