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I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.

Global Interposer Market to Surge Nearly Fivefold by 2034

09/15/2025 | I-Connect007 Editorial Team
Revenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.

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Sustainability and Selective Soldering

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Smartphone Production Rises 4% QoQ in 2Q25 as Inventory Adjustment Ends

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