Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
MIRTEC Enters Tech Collaboration Agreement with YXLON and The Comet Group
August 20, 2018 | MirtecEstimated reading time: 2 minutes
MIRTEC has entered into a technical collaboration agreement with YXLON, a company of the Comet Group. This collaboration allows both organizations to explore and expand upon synergistic applications within the SMT electronics manufacturing industry.
Pictured above, MIRTEC and YXLON equipment are on display at the Comet Group Lab ONE facility in San Jose, California. This new ‘Center of Excellence’ gives customers the opportunity to enjoy hands-on experience and demonstrations with MIRTEC’s latest solder paste inspection (SPI) and automated optical inspection (AOI) Systems in conjunction with YXLON’s state-of-the-art Automated x-ray inspection (AXI) technology. These systems are fully integrated with the SmartLoop yield improvement system.
MIRTEC, together with YXLON, have delivered a game-changing Industry 4.0 solution. SmartLoop links MIRTEC’s in-line 3D AOI with the YXLON’s at-line digital x-ray system, allowing data to flow between them seamlessly.
“3D AOI can only measure differences in Z-height on devices like BGAs and make a guestimate as to the quality of the joints underneath and the need for rework. With SmartLoop, the at-line x-ray system now becomes a verification station for the 3D height measurements taken by the AOI system. X-Ray inspection time is also dramatically reduced by targeting only suspect regions of interest that the system automatically selects for inspection. Full data integration gives the technician the tools needed for correct decisions, intelligent feedback and process improvements,” said Keith Bryant, YXLON global director of electronics sales.
“We are very excited to partner with YXLON and the Comet Group. Our intention is to collaborate on new inspection solutions for the Electronic Manufacturing Industry, combining the strengths of MIRTEC’s Award Winning 3D Inspection Technology with YXLON International’s advanced X-ray and CT inspection systems. These new solutions will provide our valued customers with leading-edge inspection capabilities required in the production of complex electronic assemblies and help pave the way toward Industry 4.0 through collaborative data integration. We look forward to a long and prosperous relationship between our organizations,” said Brian D’Amico, president of MIRTEC’s North American Sales and Service Division.
About MIRTEC
MIRTEC has earned a solid reputation with leading OEM and EMS companies throughout the world for its technologically advanced 3D inspection technology. MIRTEC products have been extremely successful in high-volume markets including cell phone and MP3 player manufacturing, as well as low-volume high-mix markets such as medical, automotive, aerospace and defense. For more information, click here.
About YXLON
YXLON, company of the Comet Group, designs and produces radioscopic and CT inspection systems for a broad variety of industrial applications and fields. Whether in the aviation and aerospace, automotive, or electronics industry, YXLON customers are among the largest manufacturers in the world. For more information, click here.
About COMET Group
The COMET Group is a globally leading, innovative Swiss technology company with a focus on the x-ray, radio frequency and ebeam businesses. With premium high-tech components and systems, we enable customers in numerous industries to both enhance the quality of their products and make their manufacturing more efficient and eco-friendly. Our innovative solutions under the COMET, YXLON and ebeam brands are in demand for applications such as materials testing and security inspection, the coating and treatment of surfaces, and non-contact sterilization. Based in Flamatt, Switzerland, the COMET Group has a presence in all world markets. We employ about 1,300 people worldwide, including approximately 440 in Switzerland. Besides production facilities in China, Denmark, Germany, Switzerland and the USA, we maintain various subsidiaries in the USA, China, Japan and Korea. COMET’s stock (COTN) is listed on the SIX Swiss Exchange. For more information, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.