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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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ASMPT Expands Virtual Assist with AI-powered Spare Parts Identification

09/29/2026 | ASMPT
ASMPT SMT Solutions, the global market and technology leader in hardware and software solutions for electronics manufacturing, is adding new service and maintenance capabilities to its Virtual Assist digital assistant.

Semtech, Palo Alto Networks Secure Industrial IoT with Zero Trust

09/29/2026 | BUSINESS WIRE
Semtech Corporation, a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (IoT) devices worldwide, announced it has completed a product integration with Palo Alto Networks Next-Generation Firewalls (NGFWs).

Koh Young Turns Measurement-based Inspection Data into Manufacturing Intelligence at SMTA International 2026

09/29/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will showcase its latest inspection and process optimization technologies at SMTA International 2026 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

Cadence, TSMC Collaborate on Certified Tools and Silicon-Proven UALink IP

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Cadence announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers.

Technica USA Participates at NEDME

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Technica USA, along with key supply partners DCT and Inovaxe, participated this week in the Northwest Electronics Design & Manufacturing Expo (NEDME) in Hillsboro, Oregon.
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