Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
BEX Introduces New Line of Nozzles
September 18, 2018 | BEXEstimated reading time: Less than a minute
BEX, a manufacturer of nozzles and eductors for manufacturing and maintenance applications, introduces a line of high-performance replacement nozzles engineered specifically for board shops and manufacturers of electronic wafers for microchips.
This BEX nozzle series includes 2 main categories of nozzles, each available in a wide variety of flow rates and angles, and each designed for maximum coverage and lowest fresh water consumption.
BEX Flat Fan Rinsing Nozzles, manufactured primarily from polypropylene or PVDF, (stainless steel is also available) are engineered for final rinses and are available in “water saver” models as low as .2 gpm. BEX Full Cone Nozzles are designed primarily for etching chambers and recirculated and final rinses; their pattern consists of multiple concentric hollow cones that together create the full cone effect with a small droplet size. In addition to nozzles, BEX manufactures eductors for use in copper plating and cleaning tanks.
To insure the best customer outcomes, Bex provides expert applications assistance for OEMs and board shops, M-F, from 8-5 EST. The company maintains a large inventory and has the industry’s fastest and most streamlined ordering process.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.