-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Ucamco’s YELO Cuts PCB Engineering, Fab Costs
September 28, 2018 | UcamcoEstimated reading time: 3 minutes
Ucamco has introduced YELO, its brand-new suite of Yield Enhancing Layout modules. With high-speed multichannel intelligence, YELO automates one of the most cumbersome tasks in PCB pre-production by scanning PCB designs for design conflicts, anomalies and potential problems, and generating alternative design solutions on the fly.
PCB manufacturers always check their customers’ incoming design data in detail prior to manufacture, using tools such as the UcamX Design Rule Check (DRC) module. More often than not, such checks highlight multiple problems, typically violations of customer-specified track widths and clearances or feature parameters, of which the CAD designer may well be unaware, and which inevitably place the PCB in a higher and more expensive manufacturing class, made even more expensive by the higher risk of scrap.
After discovering these issues, the manufacturer has two choices: capabilities permitting, the customer can be quoted a higher price to make the product as is, or, and this is where CAM engineers spend most of their time, the violations are resolved one by one, by moving features, changing track widths and other parameters, and trying to bring the product back within the client’s originally stated lower cost manufacturing class, going through multiple DRC iterations to ensure that new problems have not been created in the process. It’s a complex and time-consuming undertaking, and done manually, it is far from optimal: the engineer will typically try to resolve issues by making changes in the immediate vicinity, but the optimal solution may require a series of changes that start much further away.
This is where YELO comes in. Its Copper Adjuster Signal and Plane modules scan the entire board, and with an impressive arsenal of intelligent automated correction functionality, they shift and alter tracks, copper dams, annular rings and other features on signal, plane and mixed layers throughout the board to ensure that issues are resolved optimally, reliably, and according to customer and manufacturer design rules, to bring the PCB design within stated class and specifications while maintaining netlist integrity. Similarly, YELO Legend Adjuster scans and adjusts the size and positioning of legend as necessary.
And it’s all done with unprecedented speeds and range, says Ucamco’s Dirk Leroy. “Using combinational decisions, YELO makes multiple ‘yes/no’ decisions in parallel, making it faster and smarter than the human brain. It examines numerous iterations simultaneously, and backtracks if decisions turn out to be less than optimal.”
And where the designer’s authorisation is needed to sanction changes, YELO makes a copy of a given copper layer to document the "before and after" design situations, facilitating faster, easier communication and design turnaround times.
Ucamco is currently offering YELO free of charge for evaluation in its latest UcamX 2018.06 software distribution, together with a number of other improvements including better error reporting for Design Rules, enhanced import of Eagle fonts and customisable Rout Path Sequence. It also allows users to read UcamX jobs straight out of zip archives, as well as displaying PCB top and bottom layers in realistic colours.
If you haven’t already updated your version of UcamX, do it today and find out how YELO can brighten your business and your bottom line.
About Ucamco
Ucamco (formerly Barco ETS) is a market leader in PCB CAM software, photoplotting and direct imaging systems, with a global network of sales and support centers. Headquartered in Ghent, Belgium, Ucamco has over 25 years of ongoing experience in developing and supporting leading-edge photoplotters and front-end tooling solutions for the global PCB industry. Key to this success is the company's uncompromising pursuit of engineering excellence in all its products. Ucamco also owns the IP rights on the Gerber File Format through its acquisition of Gerber Systems Corp.
For more information, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/15/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.