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Advanced Electronics Packaging Digest

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MacDermid Alpha Shares Advanced Metallization Expertise at IMPACT and TPCA Show 2026

10/15/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, will present four technical papers at the IMPACT Conference 2026 and two additional presentations at the Tech X Total Solutions forum during the TPCA Show in Taipei.

High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method

10/15/2026 | Global Electronics Association
High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

United Electronics Corporation Installs New Automated Pumice Surface Preparation Line

10/08/2026 | United Electronics Corporation
New Circuit Tech International Pumice Line and 50-Panel Unloader Deliver Consistently Prepared Copper for Stronger Solder Mask Adhesion

KYZEN’s MICRONOX Chemistries Drive for Cleaner Power Electronics at The Battery Show 2026

10/06/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit in Booth 1631 at The Battery Show 2026, scheduled for October 12-15, at Huntington Place in Detroit, MI.

MKS Atotech Highlights Everplate Cu 300 2TF for Advanced Packaging

09/28/2026 | MKS Inc.
MKS Inc., a global provider of enabling technologies that transform our world, highlighted Everplate Cu 300 2TF from its Atotech brand.
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