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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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DENSO Supports Next-Generation Mobility Talent Through EcoCAR Challenge

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DENSO, a leading mobility supplier, is sponsoring the EcoCAR Innovation Challenge, a four-year collegiate engineering competition that prepares students to become future leaders in mobility, technology and innovation.

ASC Sunstone Circuits to Showcase Advanced PCB Manufacturing Solutions at AEMS 2026

11/04/2026 | ASC Sunstone Circuits
ASC Sunstone Circuits announces that it will exhibit at the Anaheim Electronics & Manufacturing Show (AEMS) 2026, taking place November 10–11 at the Anaheim Convention Center in Anaheim, California.

Green Circuits Appoints David Kim as Vice President of Quality

11/04/2026 | Green Circuits
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I-Connect007 Releases Episode 5 of ‘On the Line With… Qnity: Engineering What’s Next’ Podcast Series

11/04/2026 | I-Connect007
I-Connect007 announces the release of the fifth episode in its six-part podcast series, On the Line With… Qnity: Engineering What’s Next. This latest installment, titled “Engineering Heat Out of High-Power Systems,” examines the increasingly critical role of thermal management in electronics design and how innovative materials are enabling higher performance, greater reliability, and improved safety.

Cadence Joins Genesis Mission to Advance AI-Driven Science and Microelectronics

11/03/2026 | Cadence Design Systems
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