Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
Rogers Adds Advanced Battery Pad Material to Portfolio of EV/HEV Battery Solutions
December 5, 2018 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation unveils its latest advancement in protecting and extending battery life with the launch of PORON EVExtend battery pad material. Designed to address the unique challenges of electric and hybrid-electric vehicles batteries, PORON EVExtend outperforms other battery pad solutions on the market, offering superior levels of reliability and long-term durability.
PORON EVExtend further enhances Rogers’ portfolio of PORON polyurethane battery pad materials, a suite of solutions designed for cushioning and vibration isolation of lithium-ion (Li-ion) batteries. Li-ion batteries are the power source of choice for the new generation of electric, hybrid, and plug-in hybrid vehicles due to their high power density and charging efficiency. These batteries, however, pose an array of safety, life-span, and performance challenges that require advanced material solutions.
Already widely-adopted in the industry, PORON polyurethane is uniquely suited to supporting safety and dependability over the life of the EV/HEV vehicle due to its inherent ability to produce a very consistent level of force across a range of compressions. PORON material compressibility curves illustrate its strength in withstanding the stresses of compression and temperature over time, vitally important to ensuring consistent performance over the life of the battery. PORON polyurethane also extends the life of EV/HEV batteries by optimizing internal pressures which increase charge-discharge cycles.
The PORON EVExtend solution is unique when compared to other battery pad materials on the market. Engineered to apply the consistent push-back force critical to battery life and performance, PORON EVExtend maintains a more constant pushback force throughout a greater section of its compressibility curve, allowing designers to meet both beginning and end of life limits despite the expansion and contraction of battery pouch cells. With a tight specification of 5% on thickness and on compression set (per ASTM D3574 at 70⁰C), PORON EVExtend is a highly resilient material that will maintain its original thickness and properties throughout the life of the battery.
Share on:
Suggested Items
Standard of Excellence: Delivering Excellence—A Daily Goal
06/25/2025 | Anaya Vardya -- Column: Standard of ExcellenceDelivering excellence consistently across all touchpoints is essential for organizations aiming to build trust, foster customer loyalty, and maintain their brand reputation. This requires a strategic approach encompassing uniform messaging, standardized service protocols, employee training, performance monitoring, and seamless integration across platforms.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
AMD Acquires Brium to Strengthen Open AI Software Ecosystem
06/05/2025 | AMDAt AMD, we’re committed to building a high-performance, open AI software ecosystem that empowers developers and drives innovation. Today, we’re excited to take another step forward with the acquisition of Brium, a team of world-class compiler and AI software experts with deep expertise in machine learning, AI inference, and performance optimization.