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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/02/2026 | Marcy LaRont, I-Connect007
This week, I was fortunate to attend PCB West in Santa Clara, California, and was reminded of the idyllic weather of that part of California in the early fall. Attendance was high at the weeklong conference and one-day expo, allowing the show to maintain its place as one of the best events for PCB and PCB design. As always, it was great to see old friends and familiar faces. Stay tuned for more PCB West coverage.

Is AI in Design the Magic Tonic for All That Ails Us?

03/20/2026 | David Wiens, Siemens
In electronic systems design, engineering teams are pressured by management to adopt AI wherever possible to reduce design cycle time and cost. Engineers look at AI with a wary eye: Will it consistently return accurate results? Will it take longer to set up, train, run, and verify than doing it manually? Will it replace me? Yes, there is a transition with AI, but it’s no different than any other form of automation. It must be extensively

UHDI Fundamentals: UHDI Technology and Quality 5.0

09/18/2025 | Anaya Vardya, American Standard Circuits
The convergence of ultra-high density interconnect (UHDI) technology and Quality 5.0 represents a transformative leap in electronics design and manufacturing. UHDI enables extreme miniaturization and enhanced performance, while Quality 5.0 delivers adaptive, intelligent human-centric quality systems. Together, they set the foundation for advanced electronics that are smarter, more resilient, and more sustainable.

SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI

06/26/2025 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today reported findings from its latest 300mm Fab Outlook report. The report shows global front-end semiconductor suppliers are accelerating expansion efforts to support the surging demand for generative AI applications.

I-Connect007 Technical Library: Your Ultimate Free Knowledge Resource

05/12/2025 | Barb Hockaday, I-Connect007
I-Connect007’s technical library was created in 2016 with the launch of its first title, "The Printed Circuit Buyer’s Guide to AS9100 Certification." Created to satisfy a need for readily available, free technical resources, the library has become a powerful knowledge hub for the printed circuit board and electronics manufacturing supply chain.
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