Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Ventec International Group Receives Consent for IPO on Taiwan Stock Exchange
December 21, 2018 | Ventec International GroupEstimated reading time: Less than a minute
Ventec International Group Co. Ltd has received formal consent from the Taiwan Stock Exchange (TWSE) on its Initial Public Offer (IPO) application. The completion date is set for April 2019.
Ventec filed its final IPO application with the TWSE in October 2018 and the approval comes after a successful presentation to the Listings Review Committee at the beginning of December. The Paid-in Capital and Total Equity at the time of application for the listing was NT$ 646,143 thousand / NT$ 1,648,711 thousand. Among the conditions set by the TWSE for the approval is that Ventec release a further 10% of public shares before the completion date.
"We are proud to have received the official consent from the TWSE today and look forward to an expeditious launching of the public offer and successful listing of our shares in Taiwan," said Jason Chung, CEO. "This outstanding achievement is based on the strength and dedication of our global team and I am truly thankful for everyone's hard work that ensures Ventec’s success."
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Share on:
Suggested Items
Würth Elektronik Expands Signal LED Product Range
11/21/2024 | Wurth ElectronicsWürth Elektronik expands its proven LED product series WL-SMCW and WL-SMCC with white LEDs in 0603 and 0402 packages.
Nano Dimension Unveils 3D Printer for Micro Applications at Formnext
11/19/2024 | Nano DimensionNano Dimension, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announces the launch of its Exa 250vx Digital Light Processing (DLP) 3D Printer for micro applications. Developed to enable the creation of superior resolution micro parts at high production throughput, the high-speed Exa was unveiled today for the first time globally at Formnext in Frankfurt, Germany (Hall 11, Stand D22).
Würth Elektronik Offers its Radio Module for LoRaWAN Communication
11/19/2024 | Wurth ElektronikWürth Elektronik launches Daphnis-I on the market – a slim, ultra-low power consumption and long range radio module for IoT applications.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
North American Wi-Fi Sensing CPE Installations to Surge to 112 Million by 2030
11/15/2024 | ABI ResearchWi-Fi Sensing uses Wi-Fi RF wave attenuation to detect presence and motion, offering a cost-effective, easily deployable solution. Major Wi-Fi chipset vendors supporting infrastructure markets are backing this technology.