Ventec International Group Receives Consent for IPO on Taiwan Stock Exchange
December 21, 2018 | Ventec International GroupEstimated reading time: Less than a minute
Ventec International Group Co. Ltd has received formal consent from the Taiwan Stock Exchange (TWSE) on its Initial Public Offer (IPO) application. The completion date is set for April 2019.
Ventec filed its final IPO application with the TWSE in October 2018 and the approval comes after a successful presentation to the Listings Review Committee at the beginning of December. The Paid-in Capital and Total Equity at the time of application for the listing was NT$ 646,143 thousand / NT$ 1,648,711 thousand. Among the conditions set by the TWSE for the approval is that Ventec release a further 10% of public shares before the completion date.
"We are proud to have received the official consent from the TWSE today and look forward to an expeditious launching of the public offer and successful listing of our shares in Taiwan," said Jason Chung, CEO. "This outstanding achievement is based on the strength and dedication of our global team and I am truly thankful for everyone's hard work that ensures Ventec’s success."
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Suggested Items
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.
Self-Healing Materials Could Unlock the Potential of Tomorrow’s Technology, Reports IDTechEx
05/22/2025 | IDTechExA sci-fi movie trope is the virtually indestructible robot, capable of operating without rest due to extended battery life, able to interact with its surroundings like a human thanks to advanced soft robotic components, and fully autonomous due to an extensive suite of sensors.
50 Years of productronica: World’s Leading Trade Fair Celebrates Anniversary
05/21/2025 | productronicaWhen productronica takes place in Munich from November 18 to 21, 2025, a milestone birthday will be on the agenda. The world’s leading trade fair for the development and production of electronics is celebrating its 50th anniversary.
Electroninks Acquires Complete UTDots Advanced Materials Nanoinks Portfolio and IP
05/19/2025 | ElectroninksElectroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, announced it has officially completed its full acquisition of UTDots products and IP into its portfolio, further expanding its offerings in digital printing for high-performance applications.
Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025
05/19/2025 | Indium CorporationAs a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.