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Yamaha Robotics Brings Inspection Innovations for Growing Markets to electronica 2024

11/19/2024 | Yamaha Robotics SMT Section
Yamaha Robotics SMT section presented innovations in high-speed surface-mount inspection at electronica 2024, demonstrating the latest AI skills and special features for applications including LED lighting, e-mobility, and mechatronics.

The Quest for Perfect Products

11/11/2024 | Marcy LaRont, I-Connect007
Anna-Katrina Shedletsky is a former Apple engineer who formed her own company, Instrumental, to address what she felt were frustrating and costly engineering problems and inefficiencies at Apple. She’s passionate about her quest to build perfect products faster than ever before. In this interview, Anna shares her journey from creating innovative products like the Apple Watch to addressing the complexities of failure analysis in manufacturing. She also discusses an upcoming educational webinar she is hosting with Valentina Ratner, CEO of AllSpice.io, for engineering leaders in the manufacturing space. They look forward to providing “real talk” and value to their engineering colleagues.

Yamaha Robotics Appoints Roberto Ferraretto New Area Manager for Italy

10/23/2024 | Yamaha Robotics
Yamaha Robotics SMT Section has announced that Roberto Ferraretto has joined the team as Area Manager for Italy, to support the Company’s range of printers, mounters, inspection systems, and software for high-speed surface-mount and hybrid assembly.

Venus Aerospace Unveils Groundbreaking Detonation Ramjet Engine

10/08/2024 | Venus Aerospace
Venus’ advanced propulsion system is engineered to power high-speed vehicles, including drones and aircraft, enabling them to travel vast distances at high altitudes and achieve high-Mach speeds with unmatched efficiency.

Stringent High-speed Requirements Pose Technology Challenges

10/03/2024 | Tarja Rapala and Joe Beers, iNEMI
The ever-increasing demands on printed circuit boards to satisfy the needs of tomorrow’s products means that PCB manufacturers must continuously evolve and react to a wide variety of technological and market requirements such as: Functional density: Finer features, higher density, and increased layers; signal integrity: Higher frequencies, driven by higher data transfer speeds and increased data needs; material properties refinement: Must meet performance as well as environmental demands; Smart manufacturing: Automation, robotics, artificial intelligence, augmented and virtual reality, and machine learning are all part of the future PCB manufacturing floor; and time-to-market: Increased urgency to facilitate new design implementation, product introduction and qualification, quicker market differentiation, and survival.
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