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Wolfspeed Secures Conditional $1.5B U.S. Defense Loan Commitment

10/14/2026 | Wolfspeed
Wolfspeed, Inc. announced it has received a conditional loan commitment letter from the U.S. Department of War (DoW), through its Office of Strategic Capital (OSC), for up to $1.5 billion of long-term financing to support the domestic development and production of silicon carbide (SiC) materials and wide bandgap power devices, with an additional focus on U.S. national security applications.

Wolfspeed Expands 200 mm Silicon Carbide Portfolio with New Premium Power Substrates

09/28/2026 | BUSINESS WIRE
Wolfspeed, Inc., a global leader in silicon carbide (SiC) technology, announced the commercial availability of its new Premium 200 mm n-type silicon carbide substrate, expanding its 200 mm SiC materials portfolio with a higher-quality starting material designed to improve yield through reduced defects and greater wafer-shape stability.

Zhen Ding Technology Reports August 2026 Monthly Revenue

09/08/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported August 2026 revenue of NT$20,666 million, up 41.05% YoY and 17.42% MoM, again setting a record high for the same period in the company’s history.

Built Here, and Ready for What’s Next

09/08/2026 | Laura Martin, Isola
The rise of drones is no longer on the horizon. Unmanned systems have rapidly changed the modern battlefield, demonstrating the value of platforms that can sense, communicate, process information, and act at unprecedented speed. But as development and production of these systems accelerate, another mission-critical consideration is coming into focus: the supply chain behind the electronics. U.S. defense policy is focusing on reducing dependence on covered foreign sources for unmanned systems and their critical components. The message to the defense industrial base is becoming clear: Resilient, trusted supply chains matter, and the electronics inside tomorrow's unmanned platforms are part of that equation.

I-Connect007 Welcomes Newest Columnist, Tianming Liu, FSQuality

08/27/2026 | I-Connect007
I-Connect007 is excited to announce its newest columnist, Tianming Liu, founder of First Quality Circuit Co. Ltd. (FSQuality) and Fuji PCB. His new column, Bridging the Pacific, will draw on more than three decades of experience in PCB manufacturing to explore the different manufacturing cultures, practices, and perspectives found across the global electronics industry.
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