Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
New Materials Architectures Sought to Cool Hypersonic Vehicles
December 24, 2018 | DARPAEstimated reading time: 1 minute
Hypersonic vehicles fly through the atmosphere at incredibly high speeds, creating intense friction with the surrounding air as they travel at Mach 5 or above—five times faster than sound travels. Developing structures that can withstand furnace-like temperatures at such high speeds is a technical challenge, especially for leading edges that bear the brunt of the heat.
To address this thermal challenge, DARPA recently announced its Materials Architectures and Characterization for Hypersonics (MACH) program. The MACH program seeks to develop and demonstrate new design and material solutions for sharp, shape-stable, cooled leading edges for hypersonic vehicles.
“For decades people have studied cooling the hot leading edges of hypersonic vehicles but haven’t been able to demonstrate practical concepts in flight,” said Bill Carter, program manager in DARPA’s Defense Sciences Office. “The key is developing scalable materials architectures that enable mass transport to spread and reject heat. In recent years we’ve seen advances in thermal engineering and manufacturing that could enable the design and fabrication of very complex architectures not possible in the past. If successful, we could see a breakthrough in mitigating aerothermal effects at the leading edge that would enhance hypersonic performance.”
The MACH program will comprise two technical areas. The first area aims to develop and mature fully integrated passive thermal management system to cool leading edges based on scalable net-shape manufacturing and advanced thermal design. The second technical area will focus on next-generation hypersonic materials research, applying modern high-fidelity computation capabilities to develop new passive and active thermal management concepts, coatings and materials for future cooled hypersonic leading edge applications.
The MACH program seeks expertise in thermal engineering and design, advanced computational materials development, architected materials design, fabrication and testing (including net shape fabrication of high temperature metals, ceramics and their composites), hypersonic leading-edge design and performance, and advanced thermal protection systems.
Share on:
Suggested Items
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
06/26/2025 | John Watson -- Column: Elementary, Mr. WatsonThere's a story about a young woman preparing a holiday ham. Before putting it in the pan, she cuts off the ends. When asked why, she shrugs and says, "That's how my mom always did it." She asks her mother, who gives the same answer. Eventually, the question reaches Grandma, who laughs and says, "Oh, I only cut the ends off because my pan was too small." This story is a powerful analogy for how many PCB designers approach routing today.
Connect the Dots: The Future of PCB Design and Manufacturing
07/02/2025 | Matt Stevenson -- Column: Connect the DotsFor some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.
Siemens Turbocharges Semiconductor and PCB Design Portfolio with Generative and Agentic AI
06/24/2025 | SiemensAt the 2025 Design Automation Conference, Siemens Digital Industries Software today unveiled its AI-enhanced toolset for the EDA design flow.
Cadence AI Autorouter May Transform the Landscape
06/19/2025 | Andy Shaughnessy, Design007 MagazinePatrick Davis, product management director with Cadence Design Systems, discusses advancements in autorouting technology, including AI. He emphasizes a holistic approach that enhances placement and power distribution before routing. He points out that younger engineers seem more likely to embrace autorouting, while the veteran designers are still wary of giving up too much control. Will AI help autorouters finally gain industry-wide acceptance?