Matrix to Exhibit at IPC APEX EXPO 2019
January 11, 2019 | Matrix USA Inc.Estimated reading time: 1 minute
Matrix USA will be exhibiting its full line of advanced materials and process equipment to support the North American printed circuit board market. Key products include:
Panasonic Megtron Family Of High Speed Low-Loss PCB Materials – The global industry standard for high speed, low loss multi-layer circuit board materials suitable for large capacity and high speed transmission of high frequency signal for high-end ICT infrastructure equipment, automotive industry and other applications. Featuring the new Halogen Free Megtron 6 laminate and prepreg.
Panasonic Felios – Advanced adhesiveless copper clad flex materials designed to meet the demanding high performance and reliability requirements for avionic, commercial, industrial and medical markets. Featuring Felios R-F705S and R-BM17 low loss LCP flexible laminates and bond adhesives to support the growing 5G and medical markets.
Advanced Copper Foil – Featuring new arsenic free copper foils from Circuit Foil to support growing global requirements and the ACF2 and ACF3 aluminum supported ultra-thin and HVLP copper foils for the latest multilayer designs.
Perfect Point Precision Drill Tools – Featuring the new patented Carbonite specialty coated hybrid single flute drill especially designed for ultra-high tech PCB designs.
Specialized Equipment - HAKUTO cut sheet laminators, the MATRIX EC24 electrostatic cleaner and A&E automated handling equipment will be on display.
Matrix and Panasonic personnel will be available at Booth 733 to discuss the features, benefits, and advantages of these circuit board materials, equipment and value-added services.
About Matrix USA Inc.
Matrix was established in 1977 with the objective of providing quality raw material to the North American printed circuit board industry. Matrix has four rapid response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily.
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.