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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Matrix to Exhibit at IPC APEX EXPO 2019
January 11, 2019 | Matrix USA Inc.Estimated reading time: 1 minute
Matrix USA will be exhibiting its full line of advanced materials and process equipment to support the North American printed circuit board market. Key products include:
Panasonic Megtron Family Of High Speed Low-Loss PCB Materials – The global industry standard for high speed, low loss multi-layer circuit board materials suitable for large capacity and high speed transmission of high frequency signal for high-end ICT infrastructure equipment, automotive industry and other applications. Featuring the new Halogen Free Megtron 6 laminate and prepreg.
Panasonic Felios – Advanced adhesiveless copper clad flex materials designed to meet the demanding high performance and reliability requirements for avionic, commercial, industrial and medical markets. Featuring Felios R-F705S and R-BM17 low loss LCP flexible laminates and bond adhesives to support the growing 5G and medical markets.
Advanced Copper Foil – Featuring new arsenic free copper foils from Circuit Foil to support growing global requirements and the ACF2 and ACF3 aluminum supported ultra-thin and HVLP copper foils for the latest multilayer designs.
Perfect Point Precision Drill Tools – Featuring the new patented Carbonite specialty coated hybrid single flute drill especially designed for ultra-high tech PCB designs.
Specialized Equipment - HAKUTO cut sheet laminators, the MATRIX EC24 electrostatic cleaner and A&E automated handling equipment will be on display.
Matrix and Panasonic personnel will be available at Booth 733 to discuss the features, benefits, and advantages of these circuit board materials, equipment and value-added services.
About Matrix USA Inc.
Matrix was established in 1977 with the objective of providing quality raw material to the North American printed circuit board industry. Matrix has four rapid response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.