Smartphone Shipment Down 5% in 4Q18
January 31, 2019 | IDCEstimated reading time: 5 minutes
Samsung saw smartphone volumes decline 5.5% in 4Q18 with total shipments of 70.4 million units. While this was enough to maintain the top position for the quarter, its share once again fell below 20% to 18.7%, just a few points above Apple and Huawei. Things weren't much better for the full year as 2018 volumes were down 8% to 292.3 million. With a barrage of 5G smartphones right around the corner, it will be interesting to see if Samsung has enough in the tank to weather the competitive environment and maintain the top spot in the market.
Apple saw iPhone volumes drop 11.5% in 4Q18 marking one of the more challenging iPhone quarters in terms of growth, despite the three new models. Total iPhone volumes were down 3.2% for the full year, which is understandable considering its two largest markets (the United States and China) both experienced the worst year for smartphone performance ever. Apple is certainly not out of the game, but the likelihood of not having a 5G iPhone in 2019 means it will need to tell a strong iPhone and, more importantly, ecosystem story to succeed. If anyone can do it, it is Apple. But it certainly won't be easy when faced with all the other downward market pressures.
Huawei continued to capitalize on strong momentum in some markets with 4Q18 volumes up 43.9% year over year and 2018 volumes up an impressive 33.6%. Huawei continues to see growing success from its Honor line of devices, which are now representing close to half of its overall volume. China represents about half of Huawei's smartphone business, but that is dropping as the company continues its international success with growth in almost every international market where they participated in 2018.
OPPO finished 4Q18 in the fourth position with full-year shipments of 113.1 million, up 1.3% from 2017. While the growth wasn't as high as in past years, growth is still a feat given current market conditions, especially for a company that still does most of its business in China. India and Indonesia continue to be OPPO's largest focus markets outside of China with ongoing success from its A-series devices.
Xiaomi rounded out the top 5 in 4Q18 with full-year shipments up 32.2% year over year and volumes surpassing the 100 million market. Like OPPO, India and Indonesia continue to be the focus markets outside of China. However, Xiaomi has done exceptionally well in a few markets in Western Europe, most notably Spain. Its Redmi series devices continue to lead in emerging markets, but its Mi Mix/Max/Pro devices are increasingly becoming flagship contenders with attractive price points.
About IDC Trackers
IDC Tracker products provide accurate and timely market size, vendor share, and forecasts for hundreds of technology markets from more than 100 countries around the globe. Using proprietary tools and research processes, IDC's Trackers are updated on a semiannual, quarterly, and monthly basis. Tracker results are delivered to clients in user-friendly excel deliverables and on-line query tools.
About IDC
International Data Corporation (IDC) is the premier global provider of market intelligence, advisory services, and events for the information technology, telecommunications, and consumer technology markets. With more than 1,100 analysts worldwide, IDC offers global, regional, and local expertise on technology and industry opportunities and trends in over 110 countries. IDC's analysis and insight helps IT professionals, business executives, and the investment community to make fact-based technology decisions and to achieve their key business objectives. Founded in 1964, IDC is a wholly-owned subsidiary of International Data Group (IDG), the world's leading media, data and marketing services company that activates and engages the most influential technology buyers.
Page 2 of 2Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.