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Advanced Electronics Packaging Digest

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LITEON September Sales Rise 22% on Strong AI and Cloud Demand

10/14/2026 | LITEON Technology
LITEON’s consolidated revenue for September reached NT$18.8 billion, representing a 22% Y-o-Y increase.

Infineon Opens New Backend Manufacturing Hub in Thailand

10/01/2026 | Infineon
Infineon Technologies AG officially inaugurated its new backend manufacturing site in Bangkok, Samut Prakan, together with Anutin Charnvirakul, Prime Minister of Thailand and Alexander Gorski, Chief Operations Officer of Infineon Technologies.

Ducommun Incorporated Announces Follow-On Award of Significant Content Supporting PAC-3 MSE Missile Platform

09/29/2026 | Ducommun
Ducommun Incorporated, a global supplier of Engineered Products, Aftermarket and Value-Added Manufacturing Solutions for the aerospace and defense industry, is proud to announce that it has been awarded an agreement from Simmonds Precision Products, Inc. to provide electronic assemblies supporting Lockheed Martin’s PAC-3 family of missiles.

DRAM Module Revenue Surges 59% in 2025 as Supply Constraints Drive Prices Higher

09/22/2026 | TrendForce
According to TrendForce statistics, the global DRAM module market generated $21.2 billion in revenue in 2025, up a strong 59% YoY.

Gartner Forecasts Worldwide AI Spending to Grow 49.5% in 2026

09/17/2026 | Gartner, Inc.
Worldwide spending on AI is forecast to total $2.7 trillion in 2026, a 49.5% increase year-over-year, according to Gartner, Inc., a business and technology insights company.
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