MacDermid Alpha Releases Reel-to-Reel Indium Plating for Press-fit Connector Finishing
April 5, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions announced the release of M-Contact IN-2000 for sales worldwide. The M-Contact IN-2000 is an acid indium electroplating process for press-fit connector plating that is fully analyzable and easy to control. The indium deposit produced by the IN-2000 bath is naturally resistant to whiskering. With a wide current density range, greater than 90% plating efficiency over the life of the bath, and resistance to many different metallic bath contaminants, the IN-2000 is an excellent coating for any metal sub-layer.
“Fabricators that manufacture connectors, especially those for automotive applications, have been searching for ways to reduce reliance on tin finishes for many years. With the M-Contact IN-2000, we finally can offer an alternative to tin that provides a complete solution ready for specification,“ said Rich Bellemare, director for electrolytic metallization, circuitry solutions.
The M-Contact IN-2000 process is the latest expansion to the MacDermid Enthone brand family of connector plating chemistries that allows for highly customized stack combinations including copper, nickel, nickel alloys, palladium, tin, silver, gold and other precious metals.
About MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions is an Element Solutions Inc business. Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.
Suggested Items
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.