IPC Issues Call for Participation for Electronics Materials Forum
April 8, 2019 | IPCEstimated reading time: 1 minute
IPC−Association Connecting Electronics Industries invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.
The content of the IPC Electronics Materials Forum will focus on materials for board fabrication, assembly, and post-assembly protection with an emphasis on the emerging technologies that challenge our existing materials set. Developments needed for the future will be addressed, and interactive panels will extend an open forum to discuss solutions to these challenges.
IPC is seeking presentations on emerging technologies challenging existing material sets, as well as the following topics of interest:
Substrate Materials:
- Novel board laminates
- Surface finishes
- Solder mask advancements
- Flexible/wearable circuits
- HDI developments
Assembly Materials:
- New solder alloys
- Flux development
- Cleaning chemistries
- Assembly process strategies
- Thermal interface solutions
Protective Materials:
- Cleaning chemistries
- Conformal coatings
- Adhesive
- Underfills
“While many future technologies can be envisioned, they cannot be fully developed without the materials and processes to manufacture them,” said Brook Sandy-Smith, IPC technical education program manager, “this conference is ideal for engineers and managers that procure materials or want to understand advancements in materials for the board, assembly, components, and protective layers.”
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000-member company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.