Biosensor ‘Bandage’ Collects and Analyzes Sweat
April 19, 2019 | ACS PublicationsEstimated reading time: 1 minute

Like other biofluids, sweat contains a wealth of information about what’s going on inside the body. However, collecting the fluid for analysis, usually by dripping or absorbing it from the skin’s surface, can be time-consuming and messy. Now, researchers have developed a bandage-like biosensor that both collects and—in conjunction with a smart phone—analyzes sweat. The device, which could someday help diagnose diseases, is reported in ACS’ journal Analytical Chemistry.
Compared with other biofluids such as blood, sweat has the potential to be obtained less invasively for diagnostic testing. Researchers have developed tools to collect and analyze sweat, such as temporary tattoos or microfluidic devices, but they typically require wires, electronics or sophisticated structures. Tailin Xu, Li-Ping Xu, Xueji Zhang and colleagues wanted to make a wearable biosensor resembling a bandage that samples sweat and uses a simple color-changing assay to quantify various components.
To make their device, the researchers coated a flexible polyester film with a super-hydrophobic silica suspension. They then etched microwells into the silica layer to collect perspiration. At the bottom of the wells, they placed dyes that change color with pH or concentration of chloride, glucose or calcium. The team added an adhesive backing and attached the biosensor bandage onto a volunteer’s skin. When the person exercised, their perspiration collected in the microwells, and the spots changed colors. By imaging and analyzing the colors with a cell phone, the researchers determined that the sweat pH was 6.5-7.0, with a chloride concentration of about 100 mM and trace amounts of calcium and glucose. The researchers are now working on increasing the sensitivity of the device.
The authors acknowledge funding from the National Natural Science Foundation of China, Beijing Natural Science Foundation, Fundamental Research Funds for Central Universities, National Postdoctoral Innovative Talents Support Program of China, Program for Guangdong Introducing Innovative and Entrepreneurial Teams and the Shenzhen Fundamental Research Program.
Suggested Items
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Orbel Corporation Integrates Schmoll Direct Imaging
06/04/2025 | Schmoll AmericaOrbel Corporation in Easton, PA, proudly becomes the first PCM facility in the U.S. equipped with Schmoll’s MDI Direct Imaging system. This installation empowers Orbel to support customers with greater precision and quality.
Key Insights on Photoresist for Defect Reduction
05/21/2025 | I-Connect007 Editorial TeamIn PCB manufacturing, understanding the intricacies of the photoresist process is crucial for achieving high-quality results. Industry experts Josh Krick, a technical service engineer at IEC, and Tim Blair, a PCB imaging specialist at Tim Blair LLC, share their knowledge on the essential stages of photoresist application, highlight critical advancements in materials, and discuss common defects encountered during production. They share best practices and innovative solutions to enhance the manufacturing process, reduce defects, and ensure efficiency and reliability in high-tech applications.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.