Zhen Ding to Start Shipping Automotive PCBs in 2019
April 24, 2019 | DigitimesEstimated reading time: Less than a minute
Zhen Ding Technology is expected to begin shipments of its rigid-flex PCBs for automotive camera modules later in 2019, Digitimes reports. The PCB manufacturer will start generating revenues from the automotive electronics sector this year.
Zhen Ding has been engaged in the development of PCBs for automotive electronics applications for over three years, according to Digitimes. Rigid-flex PCBs for automotive camera modules are said to be the first automotive products Zhen Ding will kick off shipments of.
Suggested Items
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Scanfil Strengthens its Customer Portfolio in Medtech & Life Science by Signing Agreement with Liquid Instruments
06/27/2025 | BUSINESS WIREScanfil and Liquid Instruments have signed a manufacturing outsourcing agreement for Scanfil’s Melbourne plant in Australia. This agreement supports Liquid Instruments’ strategy to onshore production of its flagship Moku platform, strengthening domestic supply chains and bringing manufacturing closer to its research and development hub.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
₹417 Crore Electronics Manufacturing Cluster Approved in Gautam Buddha Nagar, Uttar Pradesh
06/26/2025 | Government of India Press Information BureauGovernment of India approved the setting up of a ₹417 crore Electronics Manufacturing Cluster (EMC 2.0) at Gautam Buddha Nagar, Uttar Pradesh. It aims to boost local manufacturing and innovation.
Copyright © 2025 I-Connect007 / Global Electronics Association Publishing Group All rights reserved.
Log in