Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Ventec Names Sven Schnell Tech Sales Engineer for Germany, E. Europe
May 1, 2019 | Ventec International Group Co., Ltd.Estimated reading time: 2 minutes
Ventec International Group Co., Ltd. has appointed Sven Schnell technical sales engineer. Sven will support sales activities in Germany and Eastern Europe, specializing in Ventec's advanced IMS/Thermal Management solutions including a distributed range of Thermal Interface Materials (TIM) from EMI Thermal.
Following the recent appointment of Jürgen Knörchen as Sales Director DACH in April and driven by the growing market and Ventec's strengthening position in the German-speaking region, Ventec is continuing to expand its sales force and adding further technical sales expertise. In his role as Technical Sales Engineer, Sven will be responsible for business development activities in Germany and Eastern Europe, specializing in thermal management solutions to help the company further develop its presence in the region. With his extensive knowledge and experience in applications requiring thermal performance beyond FR-4, Sven will play a key role in driving forward Ventec's insulated metal substrate (IMS) material families, thermally conductive and standard laminates and prepregs for multilayer PCBs as well as a complementary range of thermal interface materials (TIM) under Ventec's distributor agreement with EMI Thermal.
Sven has over 25 years of technical experience, joining Ventec from Henkel and Bergquist where he started out as Field Sales Manager and most recently acted as Account Manager for Siemens AG. He previously worked in sales & engineering roles with leading companies such as Würth, Hirose Electric and AVX/Elco and has a technical education in electronics.
"I am pleased to welcome Sven to our expanding technical team in Germany. His extensive industry knowledge and his specialist expertise for IMS materials will further enhance our commitment to providing technical support at the highest level to our German-speaking customers," said Jürgen Knörchen, Sales Director DACH at Ventec International Group. Mark Goodwin, COO EMEA & Americas added, "Building on the momentum from our IPO on the Taiwanese Stock Exchange this month, we continue to invest in our strong and skilled global team to help meet the growing demand for Ventec products & solutions."
About Ventec International Group
Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network. For more information, visit www.venteclaminates.com.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.