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Fresh PCB Concepts: Tariffs and the Importance of a Diverse Supply Chain

01/28/2025 | Team NCAB -- Column: Fresh PCB Concepts
With the new Trump administration, we anticipate an increase in tariffs on products from China, including printed circuit boards (PCBs). The current U.S. tariffs on PCBs from China is 25%, with two-layer and four-layer boards excluded from the tariffs until May 31, 2025. I’ve recently received a lot of questions about tariffs, even from the engineering end. While we are uncertain what the future will hold, this situation illustrates why it’s important to have a diverse supply chain.

Global PCB Connections: The Future of HDI PCBs

01/16/2025 | Jerome Larez -- Column: Global PCB Connections
High-density interconnect (HDI) printed circuit boards (PCBs) transform modern electronics by providing increased functionality, reduced sizes, and enhanced performance in complex designs. They do so by using advanced techniques, such as finer line and space definitions, microvias, and additional board layers. Specialized via structures—namely blind, buried, and stacked vias—offer complex routing while conserving space. This allows for the development of highly compact electronic devices. This article delves into HDI PCB technology, the function and benefits of blind, buried, and stacked vias, and their impact on PCB performance and design.

The Chemical Connection: Can Changing Spray Nozzles Improve My Etch Quality?

01/13/2025 | Don Ball -- Column: The Chemical Connection
Whenever the need to improve etch quality due to tightening customer specifications arises, the inevitable question asked early on is, “Will going to a different type of nozzle or nozzle flow rate make my etch quality better?” Unfortunately, the answer is most likely, “Probably not.” (Sorry, folks.) So, why not?

Data Paints a Picture—Can You See It?

01/09/2025 | Marcy LaRont, PCB007 Magazine
Andrew Kelley is CTO of Xact PCB, a company founded by engineers with firsthand experience in PCB fabricators. Xact PCB has developed a cutting-edge system to monitor and predict the registration of inner layers through advanced registration control systems. By leveraging data collected from various production stages, Xact PCB’s GX tool enhances precision. It minimizes errors, ensuring that the final products meet their customers' exact specifications while eliminating the need for costly pilot lots.

Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup

01/07/2025 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
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