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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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ABF Substrate Supply Remains Tight
May 17, 2019 | DigitimesEstimated reading time: Less than a minute
The supply of ajinomoto build-up film (ABF) substrates has been tight, and will continue to fall short of demand in the second half of 2019, Digitimes reports.
Several suppliers, including PCB makers Ibiden and Taiwan's Unimicron Technology, have plans to expand production capacity for ABF substrates while many players continue to resolve bottleneck issues to scale up their output. However, growth on the supply side will still fail to catch up with demand growth, Digitimes adds.
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Toni Patzner Becomes Global Head of Supply Chain Management at ASMPT SMT Solutions
07/01/2025 | ASMPTOn June 1, 2025, Toni Patzner assumed the position of Global Head of Supply Chain Management. The experienced manager succeeded Jörg Cwojdzinski, who retired after decades of service.
Driving Innovation: Direct Imaging vs. Conventional Exposure
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Specially Developed for Laser Plastic Welding from LPKF
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Excellon Installs COBRA Hybrid Laser at Innovative Circuits
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