Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

TTM Technologies to Exhibit at the 2024 International Electronics Circuit Exhibition in Shenzhen, China

12/04/2024 | Globe Newswire
TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (PCBs), announces that it will exhibit at the 2024 International Electronics Circuit Exhibition (Shenzhen).

Infleqtion Secures $11 Million DoD APFIT Award to Accelerate Deployment of Quantum Timing for Defense Applications

12/04/2024 | BUSINESS WIRE
Infleqtion, the world’s leading quantum information company, today announced its receipt of $11 million in funding from the U.S. Department of Defense (DoD) as part of the latest tranche of awards under the Accelerate the Procurement and Fielding of Innovative Technologies (APFIT) program.

Rheinmetall, Hologate Sign Strategic Cooperation

12/03/2024 | Rheinmetall
Düsseldorf-based Rheinmetall AG, a leading company in the field of defense and security technologies, and Hologate, the world's leading provider of sophisticated Extended Reality (XR) solutions in the field of simulation and entertainment, intend to work closely together in the future to develop innovative simulation solutions.

Nolan’s Notes: Soldering Technologies

12/03/2024 | Nolan Johnson -- Column: Nolan's Notes
There are schools of thought that soldering methods are similarly anachronistic but still useful enough not to be worth changing. While that may be true, I see that soldering technologies are experiencing significant changes. It might not be apparent on the surface, but changes are afoot, and there are some disruptive things underway as well.

SMT007 Magazine Explores Soldering Technologies—December 2024

12/02/2024 | I-Connect007 Editorial Team
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in